CMOS 60-GHz and E-band Power Amplifiers and Transmitters

  • Dixian Zhao
  • Patrick Reynaert

Part of the Analog Circuits and Signal Processing book series (ACSP)

Table of contents

  1. Front Matter
    Pages i-xiii
  2. Dixian Zhao, Patrick Reynaert
    Pages 1-11
  3. Dixian Zhao, Patrick Reynaert
    Pages 13-32
  4. Dixian Zhao, Patrick Reynaert
    Pages 33-57
  5. Dixian Zhao, Patrick Reynaert
    Pages 59-86
  6. Dixian Zhao, Patrick Reynaert
    Pages 87-114
  7. Dixian Zhao, Patrick Reynaert
    Pages 115-137
  8. Dixian Zhao, Patrick Reynaert
    Pages 139-169
  9. Dixian Zhao, Patrick Reynaert
    Pages 171-175
  10. Back Matter
    Pages 177-179

About this book

Introduction

This book focuses on the development of design techniques and methodologies for 60-GHz and E-band power amplifiers and transmitters at device, circuit and layout levels. The authors show the recent development of millimeter-wave design techniques, especially of power amplifiers and transmitters, and presents novel design concepts, such as “power transistor layout” and “4-way parallel-series power combiner”, that can enhance the output power and efficiency of power amplifiers in a compact silicon area. Five state-of-the-art 60-GHz and E-band designs with measured results are demonstrated to prove the effectiveness of the design concepts and hands-on methodologies presented. This book serves as a valuable reference for circuit designers to develop millimeter-wave building blocks for future 5G applications.

Keywords

5G Networks 60-GHz and E-band Technologies Analog Circuits and Signal Processing CMOS at Millimeter Wave Frequencies CMOS mm-wave Circuit Design CMOS mm-wave Front-Ends for Wireless Communication High-Frequency Integrated Circuits Millimeter Wave Transmitters in CMOS

Authors and affiliations

  • Dixian Zhao
    • 1
  • Patrick Reynaert
    • 2
  1. 1.National Mobile Communication Research LaboratorySoutheast UniversityNanjingChina
  2. 2.ESAT-MICASKU LeuvenLeuvenBelgium

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-18839-3
  • Copyright Information Springer International Publishing Switzerland 2015
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-18838-6
  • Online ISBN 978-3-319-18839-3
  • Series Print ISSN 1872-082X
  • Series Online ISSN 2197-1854
  • About this book
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