High-Bandwidth Memory Interface

  • Chulwoo Kim
  • Hyun-Woo Lee
  • Junyoung Song

Part of the SpringerBriefs in Electrical and Computer Engineering book series (BRIEFSELECTRIC)

Table of contents

  1. Front Matter
    Pages i-viii
  2. Chulwoo Kim, Junyoung Song, Hyun-Woo Lee
    Pages 1-11
  3. Chulwoo Kim, Junyoung Song, Hyun-Woo Lee
    Pages 13-24
  4. Chulwoo Kim, Junyoung Song, Hyun-Woo Lee
    Pages 25-49
  5. Chulwoo Kim, Junyoung Song, Hyun-Woo Lee
    Pages 51-76
  6. Chulwoo Kim, Junyoung Song, Hyun-Woo Lee
    Pages 77-86
  7. Back Matter
    Pages 87-88

About this book

Introduction

This book provides an overview of recent advances in memory interface design at both the architecture and circuit levels. Coverage includes signal integrity and testing, TSV interface, high-speed serial interface including equalization, ODT, pre-emphasis, wide I/O interface including crosstalk, skew cancellation, and clock generation and distribution. Trends for further bandwidth enhancement are also covered.
 
• Enables readers with minimal background in memory design to understand the basics of high-bandwidth memory interface design;
• Presents state-of-the-art techniques for memory interface design;
• Covers memory interface design at both the circuit level and system architecture level.

Keywords

DRAM DRAM Circuit Design DRAM Interface Design High Performance Memory Design High Performance Memory Design High-Bandwidth Memory Interface TSV Interface for DRAM

Authors and affiliations

  • Chulwoo Kim
    • 1
  • Hyun-Woo Lee
    • 2
  • Junyoung Song
    • 3
  1. 1.Department of Electrical Engineering #418 Engineering Bldg.Korea UniversitySeoulKorea, Republic of (South Korea)
  2. 2.SK-HynixIcheon-siKorea, Republic of (South Korea)
  3. 3.Department of Electrical Engineering #418 Engineering Bldg.Korea UniversitySeoulKorea, Republic of (South Korea)

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-02381-6
  • Copyright Information The Author(s) 2014
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-02380-9
  • Online ISBN 978-3-319-02381-6
  • Series Print ISSN 2191-8112
  • Series Online ISSN 2191-8120
  • About this book
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