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Design-for-Test and Test Optimization Techniques for TSV-based 3D Stacked ICs

  • Brandon Noia
  • Krishnendu Chakrabarty

Table of contents

  1. Front Matter
    Pages i-xviii
  2. Brandon Noia, Krishnendu Chakrabarty
    Pages 1-10
  3. Brandon Noia, Krishnendu Chakrabarty
    Pages 11-54
  4. Brandon Noia, Krishnendu Chakrabarty
    Pages 55-79
  5. Brandon Noia, Krishnendu Chakrabarty
    Pages 81-113
  6. Brandon Noia, Krishnendu Chakrabarty
    Pages 115-135
  7. Brandon Noia, Krishnendu Chakrabarty
    Pages 159-180
  8. Brandon Noia, Krishnendu Chakrabarty
    Pages 181-237
  9. Brandon Noia, Krishnendu Chakrabarty
    Pages 239-240
  10. Back Matter
    Pages 241-245

About this book

Introduction


This book describes innovative techniques to address the testing needs of 3D stacked integrated circuits (ICs) that utilize through-silicon-vias (TSVs) as vertical interconnects.  The authors identify the key challenges facing 3D IC testing and present results that have emerged from cutting-edge research in this domain.  Coverage includes topics ranging from die-level wrappers, self-test circuits, and TSV probing to test-architecture design, test scheduling, and optimization.  Readers will benefit from an in-depth look at test-technology solutions that are needed to make 3D ICs a reality and commercially viable.
 
• Provides a comprehensive guide to the challenges and solutions for the testing of TSV-based 3D stacked ICs;
• Includes in-depth explanation of key test and design-for-test technologies, emerging standards, and test- architecture and test-schedule optimizations;
• Encompasses all aspects of test as related to 3D ICs, including pre-bond and post-bond test as well as the test optimization and scheduling necessary to ensure that 3D testing remains cost-effective.
 

Keywords

3D Built-in Seft Test 3D IC Test 3D Integrated Circuit Design 3D Memory Test BIST for TSVs Through-Silicon Via

Authors and affiliations

  • Brandon Noia
    • 1
  • Krishnendu Chakrabarty
    • 2
  1. 1.ECEDuke UniversityDurhamUSA
  2. 2.ECEDuke UniversityDurhamUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-02378-6
  • Copyright Information Springer International Publishing Switzerland 2014
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-02377-9
  • Online ISBN 978-3-319-02378-6
  • Buy this book on publisher's site
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