Silicon Analog Components

Device Design, Process Integration, Characterization, and Reliability

  • Badih El-Kareh
  • Lou N. Hutter

Table of contents

  1. Front Matter
    Pages i-xli
  2. Badih El-Kareh, Lou N. Hutter
    Pages 1-24
  3. Badih El-Kareh, Lou N. Hutter
    Pages 25-63
  4. Badih El-Kareh, Lou N. Hutter
    Pages 65-109
  5. Badih El-Kareh, Lou N. Hutter
    Pages 111-146
  6. Badih El-Kareh, Lou N. Hutter
    Pages 147-204
  7. Badih El-Kareh, Lou N. Hutter
    Pages 205-274
  8. Badih El-Kareh, Lou N. Hutter
    Pages 275-356
  9. Badih El-Kareh, Lou N. Hutter
    Pages 357-409
  10. Badih El-Kareh, Lou N. Hutter
    Pages 411-456
  11. Badih El-Kareh, Lou N. Hutter
    Pages 457-501
  12. Badih El-Kareh, Lou N. Hutter
    Pages 503-581
  13. Back Matter
    Pages 583-607

About this book

Introduction

This book covers modern analog components, their characteristics, and interactions with process parameters. It serves as a comprehensive guide, addressing both the theoretical and practical aspects of modern silicon devices and the relationship between their electrical properties and processing conditions. Based on the authors’ extensive experience in the development of analog devices, this book is intended for engineers and scientists in semiconductor research, development and manufacturing. The problems at the end of each chapter and the numerous charts, figures and tables also make it appropriate for use as a text in graduate and advanced undergraduate courses in electrical engineering and materials science.

Keywords

BCD Processes and Devices CMOS, BiCMOS Processes Diodes, Transistors Book El-Kareh Silicon Device Design High-voltage DECMOS Physics of Analog Components Silicon Analog Components Varactors, Capacitors Book

Authors and affiliations

  • Badih El-Kareh
    • 1
  • Lou N. Hutter
    • 2
  1. 1.PIYECedar ParkUSA
  2. 2.Lou Hutter ConsultingPlanoUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4939-2751-7
  • Copyright Information Springer Science+Business Media New York 2015
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4939-2750-0
  • Online ISBN 978-1-4939-2751-7
  • About this book
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