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CMOS Test and Evaluation

A Physical Perspective

  • Manjul Bhushan
  • Mark B. Ketchen

Table of contents

  1. Front Matter
    Pages i-xiii
  2. Manjul Bhushan, Mark B. Ketchen
    Pages 1-15
  3. Manjul Bhushan, Mark B. Ketchen
    Pages 17-83
  4. Manjul Bhushan, Mark B. Ketchen
    Pages 85-123
  5. Manjul Bhushan, Mark B. Ketchen
    Pages 125-157
  6. Manjul Bhushan, Mark B. Ketchen
    Pages 159-199
  7. Manjul Bhushan, Mark B. Ketchen
    Pages 201-239
  8. Manjul Bhushan, Mark B. Ketchen
    Pages 241-284
  9. Manjul Bhushan, Mark B. Ketchen
    Pages 285-310
  10. Manjul Bhushan, Mark B. Ketchen
    Pages 311-345
  11. Manjul Bhushan, Mark B. Ketchen
    Pages 347-398
  12. Back Matter
    Pages 399-424

About this book

Introduction

This book extends test structure applications described in Microelectronic Test Struc­tures for CMOS Technology (Springer 2011) to digital CMOS product chips. Intended for engineering students and professionals, this book provides a single comprehensive source for evaluating CMOS technology and product test data from a basic knowledge of the physical behavior of the constituent components. Elementary circuits that exhibit key properties of complex CMOS chips are simulated and analyzed, and an integrated view of design, test and characterization is developed. Appropriately designed circuit monitors embedded in the CMOS chip serve to correlate CMOS technology models and circuit design tools to the hardware and also aid in test debug. Impact of silicon process variability, reliability, and power and performance sensitivities to a range of product application conditions are described. Circuit simulations exemplify the methodologies presented, and problems are included at the end of the chapters.

Keywords

CMOS manufacturing test and quality control CMOS microelectronic test structures CMOS products CMOS statistical data analysis CMOS test

Authors and affiliations

  • Manjul Bhushan
    • 1
  • Mark B. Ketchen
    • 2
  1. 1.OctEvalHopewell JunctionUSA
  2. 2.OcteVueHadleyUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4939-1349-7
  • Copyright Information Springer Science+Business Media New York 2015
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4939-1348-0
  • Online ISBN 978-1-4939-1349-7
  • Buy this book on publisher's site
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