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Design Exploration of Emerging Nano-scale Non-volatile Memory

  • Hao Yu
  • Yuhao Wang

Table of contents

  1. Front Matter
    Pages i-x
  2. Hao Yu, Yuhao Wang
    Pages 1-27
  3. Hao Yu, Yuhao Wang
    Pages 29-44
  4. Hao Yu, Yuhao Wang
    Pages 45-83
  5. Hao Yu, Yuhao Wang
    Pages 85-129
  6. Hao Yu, Yuhao Wang
    Pages 131-180
  7. Back Matter
    Pages 181-192

About this book

Introduction

This book presents the latest techniques for characterization, modeling and design for nano-scale non-volatile memory (NVM) devices.  Coverage focuses on fundamental NVM device fabrication and characterization, internal state identification of memristic dynamics with physics modeling, NVM circuit design, and hybrid NVM memory system design-space optimization. The authors discuss design methodologies for nano-scale NVM devices from a circuits/systems perspective, including the general foundations for the fundamental memristic dynamics in NVM devices.  Coverage includes physical modeling, as well as the development of a platform to explore novel hybrid CMOS and NVM circuit and system design.
 
• Offers readers a systematic and comprehensive treatment of emerging nano-scale non-volatile memory (NVM) devices;
• Focuses on the internal state of NVM memristic dynamics, novel NVM readout and memory cell circuit design, and hybrid NVM memory system optimization;
• Provides both theoretical analysis and practical examples to illustrate design methodologies;
• Illustrates design and analysis for recent developments in spin-toque-transfer, domain-wall racetrack and memristors.

Keywords

Emerging Memory Hybrid Memory Design Memristic Dynamics Memristors Nano-scale Non-volatile Memory Nonvolatile Memory

Authors and affiliations

  • Hao Yu
    • 1
  • Yuhao Wang
    • 2
  1. 1.School of EEENanyang Technological UniversitySingaporeSingapore
  2. 2.School of EEENanyang Technological UniversitySingaporeSingapore

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4939-0551-5
  • Copyright Information Springer Science+Business Media New York 2014
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4939-0550-8
  • Online ISBN 978-1-4939-0551-5
  • Buy this book on publisher's site
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