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Bibliographic Information
Book Title: Advances in Electronic Circuit Packaging
Book Subtitle: Volume 2 Proceedings of the Second International Electronic Circuit Packaging Symposium, sponsored by the University of Colorado and EDN (Electrical Design News), held at Boulder, Colorado
Editors: Gerald A. Walker
DOI: https://doi.org/10.1007/978-1-4899-7311-5
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 1962
Softcover ISBN: 978-1-4899-7297-2Published: 01 January 1962
eBook ISBN: 978-1-4899-7311-5Published: 11 December 2013
Edition Number: 1
Number of Pages: XV, 328
Number of Illustrations: 176 b/w illustrations
Topics: Electronic Circuits and Devices, Electronics and Microelectronics, Instrumentation
Industry Sectors: Aerospace, Automotive, Electronics, Energy, Utilities & Environment, Engineering, IT & Software, Oil, Gas & Geosciences, Telecommunications