Overview
Part of the book series: The Springer International Series in Engineering and Computer Science (SECS, volume 250)
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Table of contents (5 chapters)
Keywords
About this book
Inherent in the design of electronic modules are tradeoffs which must be understood before feasible technology, material, process, and partitioning choices can be selected. The lack of a complete set of technology information is an especially serious problem in the packaging and interconnect field since the number of technologies, process, and materials is substantial and selecting optimums is arduous and non-trivial if one truly wants a balance in cost and performance. Numerous tradeoff and design decisions have to be made intelligently and quickly at the beginning of the design cycle before physical design work begins. These critical decisions, made within the first 10% of the total design cycle, ultimately define up to 80% of the final product cost.
Conceptual Design of Multichip Modules and Systems lays the groundwork for concurrent estimation level analysis including size, routing, electrical performance, thermal performance, cost, reliability, manufacturability, and testing. It will be useful both as a reference for system designers and as a text for those wishing to gain a perspective on the nature of packaging and interconnect design, concurrent engineering, computer-aided design, and system synthesis.
Authors and Affiliations
Bibliographic Information
Book Title: Conceptual Design of Multichip Modules and Systems
Authors: Peter A. Sandborn, Hector Moreno
Series Title: The Springer International Series in Engineering and Computer Science
DOI: https://doi.org/10.1007/978-1-4757-4841-3
Publisher: Springer New York, NY
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eBook Packages: Springer Book Archive
Copyright Information: Springer Science+Business Media New York 1994
Hardcover ISBN: 978-0-7923-9395-5Published: 31 October 1993
Softcover ISBN: 978-1-4419-5137-3Published: 07 December 2010
eBook ISBN: 978-1-4757-4841-3Published: 14 March 2013
Series ISSN: 0893-3405
Edition Number: 1
Number of Pages: XVI, 260
Industry Sectors: Aerospace, Automotive, Electronics, Energy, Utilities & Environment, Engineering, IT & Software, Oil, Gas & Geosciences, Telecommunications