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Wireless Cortical Implantable Systems

  • Vahid Majidzadeh Bafar
  • Alexandre Schmid

Table of contents

  1. Front Matter
    Pages i-xviii
  2. Vahid Majidzadeh Bafar, Alexandre Schmid
    Pages 1-7
  3. Vahid Majidzadeh Bafar, Alexandre Schmid
    Pages 9-18
  4. Vahid Majidzadeh Bafar, Alexandre Schmid
    Pages 19-42
  5. Vahid Majidzadeh Bafar, Alexandre Schmid
    Pages 43-65
  6. Vahid Majidzadeh Bafar, Alexandre Schmid
    Pages 67-130
  7. Vahid Majidzadeh Bafar, Alexandre Schmid
    Pages 131-177
  8. Vahid Majidzadeh Bafar, Alexandre Schmid
    Pages 179-183
  9. Back Matter
    Pages 185-193

About this book

Introduction

Wireless Cortical Implantable Systems examines the design for data acquisition and transmission in cortical implants. The first part of the book covers existing system-level cortical implants, as well as future devices. The authors discuss the major constraints in terms of microelectronic integration. The second part of the book focuses on system-level as well as circuit and system level solutions to the development of ultra low-power and low-noise microelectronics for cortical implants. Existing solutions are presented and novel methods and solutions proposed. The third part of the book focuses on the usage of digital impulse radio ultra wide-band transmission as an efficient method to transmit cortically neural recorded data at high data-rate to the outside world. Original architectural and circuit and system solutions are discussed.

Keywords

Cortical Implants Delayed-locked-loop Delta Modulator IR-UWB Transmitter Inductive Coupling LDO Voltage Regulator Low-noise Amplifier Multi-channel Recording NEF Noise Efficiency Factor Pulse Position Modulation Walsh-Hadamard Coding

Authors and affiliations

  • Vahid Majidzadeh Bafar
    • 1
  • Alexandre Schmid
    • 2
  1. 1.Swiss Federal Institute of TechnologyLausanneSwitzerland
  2. 2.Swiss Federal Institute of TechnologyLausanneSwitzerland

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-6702-1
  • Copyright Information Springer Science+Business Media New York 2013
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-6701-4
  • Online ISBN 978-1-4614-6702-1
  • Buy this book on publisher's site
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