High Performance Multi-Channel High-Speed I/O Circuits

  • Taehyoun Oh
  • Ramesh Harjani

Part of the Analog Circuits and Signal Processing book series (ACSP)

Table of contents

  1. Front Matter
    Pages i-x
  2. Taehyoun Oh, Ramesh Harjani
    Pages 1-9
  3. Taehyoun Oh, Ramesh Harjani
    Pages 47-67
  4. Taehyoun Oh, Ramesh Harjani
    Pages 69-71
  5. Back Matter
    Pages 73-89

About this book

Introduction

This book describes design techniques that can be used to mitigate crosstalk in high-speed I/O circuits. The focus of the book is in developing compact and low power integrated circuits for crosstalk cancellation, inter-symbol interference (ISI) mitigation and improved bit error rates (BER) at higher speeds.  This book is one of the first to discuss in detail the problem of crosstalk and ISI mitigation encountered as data rates have continued beyond 10Gb/s. Readers will learn to avoid the data performance cliff, with circuits and design techniques described for novel, low power crosstalk cancellation methods that are easily combined with current ISI mitigation architectures.

·         Describes technology and design ideas for power-efficient crosstalk cancellation in multi-channel high-speed I/O circuits;

·         Includes critical background knowledge related to channel ISI equalization circuits;

·         Provides crosstalk cancellation circuit methods that can be adapted efficiently to currently used equalization circuits in high-speed I/O receivers; key crosstalk cancellation blocks can be merged easily with automatic gain control (AGC) circuits in current I/O systems.

Keywords

Analog Circuits and Signal Processing Channel Inter-Symbol Interference Crosstalk Cancellation and Signal Reutilization Crosstalk Channel Modeling High-Speed Chip-to-Chip Communications Multi-Channel High-Speed I/O Circuits Wireless Communication

Authors and affiliations

  • Taehyoun Oh
    • 1
  • Ramesh Harjani
    • 2
  1. 1.Department of ECEUniversity of MinnesotaMinneapolisUSA
  2. 2.Department of ECEUniversity of MinnesotaMinneapolisUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-4963-8
  • Copyright Information Springer Science+Business Media New York 2014
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-4962-1
  • Online ISBN 978-1-4614-4963-8
  • Series Print ISSN 1872-082X
  • Series Online ISSN 2197-1854
  • About this book
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