Next Generation Microchannel Heat Exchangers

  • Michael Ohadi
  • Kyosung Choo
  • Serguei Dessiatoun
  • Edvin Cetegen

Part of the SpringerBriefs in Applied Sciences and Technology book series (BRIEFSAPPLSCIENCES)

Also part of the SpringerBriefs in Thermal Engineering and Applied Science book sub series (BRIEFSTHERMAL)

Table of contents

  1. Front Matter
    Pages i-xii
  2. Michael Ohadi, Kyosung Choo, Serguei Dessiatoun, Edvin Cetegen
    Pages 1-32
  3. Michael Ohadi, Kyosung Choo, Serguei Dessiatoun, Edvin Cetegen
    Pages 33-65
  4. Michael Ohadi, Kyosung Choo, Serguei Dessiatoun, Edvin Cetegen
    Pages 67-105
  5. Back Matter
    Pages 107-116

About this book

Introduction

In Next Generation Microchannel Heat Exchangers, the authors’ focus on the new generation highly efficient heat exchangers and presentation of novel data and technical expertise not available in the open literature.  Next generation micro channels offer record high heat transfer coefficients with pressure drops much less than conventional micro channel heat exchangers. These inherent features promise fast penetration into many mew markets, including high heat flux cooling of electronics, waste heat recovery and energy efficiency enhancement applications, alternative energy systems, as well as applications in mass exchangers and chemical reactor systems. The combination of up to the minute research findings and technical know-how make this book very timely as the search for high performance heat and mass exchangers that can cut costs in materials consumption intensifies.

Keywords

electronics cooling exchangers heat transfer augmentation high efficiency compact heat and mass high flux cooling micro heat exchangers micro mass exchangers micro reactors microchannel heat exchangers spot cooling transient cooling

Authors and affiliations

  • Michael Ohadi
    • 1
  • Kyosung Choo
    • 2
  • Serguei Dessiatoun
    • 3
  • Edvin Cetegen
    • 4
  1. 1.Department of Mechanical EngineeringUniversity of MarylandCollege ParkUSA
  2. 2.Department of Mechanical EngineeringUniversity of MarylandCollege ParkUSA
  3. 3.Department of Mechanical EngineeringUniversity of MarylandCollege ParkUSA
  4. 4.Intel CorporationChandlerUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4614-0779-9
  • Copyright Information The Author(s) 2013
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4614-0778-2
  • Online ISBN 978-1-4614-0779-9
  • Series Print ISSN 2191-530X
  • Series Online ISSN 2191-5318
  • About this book
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