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Life-Cycle Assessment of Semiconductors

  • Sarah B. Boyd

Table of contents

  1. Front Matter
    Pages i-xxvii
  2. Sarah B. Boyd
    Pages 1-12
  3. Sarah B. Boyd
    Pages 13-26
  4. Sarah B. Boyd
    Pages 69-86
  5. Sarah B. Boyd
    Pages 87-96
  6. Sarah B. Boyd
    Pages 109-112
  7. Back Matter
    Pages 113-226

About this book

Introduction

Life-Cycle Assessment of Semiconductors presents the first and thus far only available transparent and complete life cycle assessment of semiconductor devices. A lack of reliable semiconductor LCA data has been a major challenge to evaluation of the potential environmental benefits of information technologies (IT). The analysis and results presented in this book will allow a higher degree of confidence and certainty in decisions concerning the use of IT in efforts to reduce climate change and other environmental effects. Coverage includes but is not limited to semiconductor manufacturing trends by product type and geography, unique coverage of life-cycle assessment, with a focus on uncertainty and sensitivity analysis of energy and global warming missions for CMOS logic devices, life cycle assessment of flash memory and life cycle assessment of DRAM. The information and conclusions discussed here will be highly relevant and useful to individuals and institutions. The book also:

  • Provides a detailed, complete and transparent life cycle assessment of semiconductor logic and memory devices
  • Offers thorough evaluations of many technology generations of semiconductor logic and memory
  • Contains an overview of environmentally significant trends in the semiconductor industry
Life-Cycle Assessment of Semiconductors is an ideal book for researchers and engineers interested in the environmental impact of semiconductor manufacturing.

Keywords

CMOS Flash Memory Life Cycle Assessment Random Access Memory Semiconductor Manufacturing

Authors and affiliations

  • Sarah B. Boyd
    • 1
  1. 1.Pe Americas, LLCBostonUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4419-9988-7
  • Copyright Information Springer Science+Business Media, LLC 2012
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-9987-0
  • Online ISBN 978-1-4419-9988-7
  • Buy this book on publisher's site
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