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Ultra-Low Power Integrated Circuit Design

Circuits, Systems, and Applications

  • Nianxiong Nick Tan
  • Dongmei Li
  • Zhihua Wang

Part of the Analog Circuits and Signal Processing book series (ACSP, volume 85)

Table of contents

  1. Front Matter
    Pages i-x
  2. Xueping Jiang, Nianxiong Nick Tan
    Pages 1-10
  3. Liyuan Liu, Zhihua Wang
    Pages 11-14
  4. Shupeng Zhong, Nianxiong Nick Tan
    Pages 15-29
  5. Liyuan Liu, Dongmei Li, Zhihua Wang
    Pages 31-66
  6. Liming Chen, Yong Hei, Zenghui Yu, Jia Yuan, Jinyong Xue
    Pages 67-105
  7. Hanjun Jiang, Nanjian Wu, Baoyong Chi, Fule Li, Lingwei Zhang, Zhihua Wang
    Pages 107-143
  8. Kun Yang, Shupeng Zhong, Quan Kong, Changyou Men, Nianxiong Nick Tan
    Pages 145-168
  9. Yan Zhao, Shupeng Zhong, Kun Yang, Changyou Men, Nianxiong Nick Tan, Xueping Jiang
    Pages 169-195
  10. Kun Yang, Liyuan Liu, Shupeng Zhong, Nianxiong Nick Tan
    Pages 197-218
  11. Hanjun Jiang, Xinkai Chen, Zhihua Wang
    Pages 219-232

About this book

Introduction

This book describes the design of CMOS circuits for ultra-low power consumption including analog, radio frequency (RF), and digital signal processing circuits (DSP). The book addresses issues from circuit and system design to production design, and applies the ultra-low power circuits described to systems for digital hearing aids and capsule endoscope devices.

  • Provides a valuable introduction to ultra-low power circuit design, aimed at practicing design engineers;
  • Describes all key building blocks of ultra-low power circuits, from a systems perspective;
  • Applies circuits and systems described to real product examples such as hearing aids and capsule endoscopes.

Keywords

Analog Circuits and Signal Processing Bioelectronics Biomedical circuits and systems Low Power Design Low power bioelectronics Low power biomedical circuits and systems Low power circuit architecture Power Management Ultra-low power circuit design Ultra-low power transceiver design

Editors and affiliations

  • Nianxiong Nick Tan
    • 1
  • Dongmei Li
    • 2
  • Zhihua Wang
    • 3
  1. 1.Zhejiang UniversityHangzhouPeople's Republic of China
  2. 2.Tsinghua UniversityBeijingPeople's Republic of China
  3. 3.Tsinghua UniversityBeijingPeople's Republic of China

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4419-9973-3
  • Copyright Information Springer Science+Business Media New York 2014
  • Publisher Name Springer, New York, NY
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-9972-6
  • Online ISBN 978-1-4419-9973-3
  • Series Print ISSN 1872-082X
  • Series Online ISSN 2197-1854
  • Buy this book on publisher's site
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