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Coupled Data Communication Techniques for High-Performance and Low-Power Computing

  • Ron Ho
  • Robert Drost

Part of the Integrated Circuits and Systems book series (ICIR, volume 0)

Table of contents

  1. Front Matter
    Pages i-xvi
  2. Introduction

    1. Front Matter
      Pages 1-1
    2. Ron Ho, Robert Drost
      Pages 3-10
  3. Overview of 3D Technologies

    1. Front Matter
      Pages 12-12
    2. Muhannad Bakir, Gang Huang, Bing Dang
      Pages 13-48
  4. Coupled Data Technologies

    1. Front Matter
      Pages 50-50
    2. David Hopkins, Alex Chow, Frankie Liu, Dinesh D. Patil, Hans Eberle
      Pages 51-77
    3. Noriyuki Miura, Takayasu Sakurai, Tadahiro Kuroda
      Pages 79-125
  5. Enabling Coupled Data Technologies

    1. Front Matter
      Pages 156-156
    2. John E. Cunningham, Ashok V. Krishnamoorthy, Ivan Shubin, James G. Mitchell, Xuezhe Zheng
      Pages 157-175
  6. Extending Data Coupling Technologies

    1. Front Matter
      Pages 178-178
    2. Ashok V. Krishnamoorthy, Jon Lexau, Xuezhe Zheng, John E. Cunningham
      Pages 179-192
    3. Makoto Takamiya, Kohei Onizuka, Takayasu Sakurai
      Pages 193-204
  7. Back Matter
    Pages 205-206

About this book

Introduction

Designers of next-generation high-performance computer systems face a host of technical challenges. For the past several decades, rising clock frequencies and increased chip integration have fueled the growth of computer performance. Now these trends have slowed: power and complexity constrains further increases in clock frequencies, and economic realities limit the pace of Moore's Law. Coupled data communication provides a way forward, and this book, Coupled Data Communication Techniques for High-Performance and Low-Power Computing, gives a comprehensive overview for such coupled data techniques. Coupled data communication allows chips to communicate—capacitively or inductively—over short distances between chips without solder, and fundamentally shifts the design paradigm from single-chip integration to single-package integration. This book covers the state-of-the-art in the circuits, architectures, and chip packaging for this novel chip-to-chip communication technology and showcases its potential to drive the coming decades of industry growth. Coupled Data Communication Techniques for High-Performance and Low-Power Computing should be of interest to students and designers in circuits and system architecture.

Keywords

Drost Signal chip packaging communication complexity coupled data communication high-performance integrated circuit integrated circuits interconnect low-power manufacturing modeling

Editors and affiliations

  • Ron Ho
    • 1
  • Robert Drost
    • 2
  1. 1.Sun Microsystems Laboratories, VLSI Research GroupSun Microsystems, Inc.Menlo ParkUSA
  2. 2.Sun Microsystems Laboratories, VLSI Research GroupSun Microsystems, Inc.Menlo ParkUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-4419-6588-2
  • Copyright Information Springer Science+Business Media, LLC 2010
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-1-4419-6587-5
  • Online ISBN 978-1-4419-6588-2
  • Series Print ISSN 1558-9412
  • Buy this book on publisher's site
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