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The Engineering of Microelectronic Thin and Thick Films

  • Authors
  • C. E. Jowett
Textbook

Table of contents

  1. Front Matter
    Pages i-vii
  2. C. E. Jowett
    Pages 1-12
  3. C. E. Jowett
    Pages 13-35
  4. C. E. Jowett
    Pages 36-62
  5. C. E. Jowett
    Pages 81-96
  6. C. E. Jowett
    Pages 97-99
  7. C. E. Jowett
    Pages 111-125
  8. C. E. Jowett
    Pages 126-143
  9. C. E. Jowett
    Pages 144-149
  10. C. E. Jowett
    Pages 150-153
  11. C. E. Jowett
    Pages 154-167
  12. Back Matter
    Pages 168-176

About this book

Keywords

adhesion base bonding copper dispersion elastomer environmental protection heat metals resistance resistivity separation structure temperature thin films

Bibliographic information

  • DOI https://doi.org/10.1007/978-1-349-02684-5
  • Copyright Information Macmillan Publishers Limited 1976
  • Publisher Name Palgrave, London
  • eBook Packages Engineering
  • Print ISBN 978-1-349-02686-9
  • Online ISBN 978-1-349-02684-5
  • Buy this book on publisher's site
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