Micro-Assembly Technologies and Applications

1. Front Matter

   Pages i-xiii

   PDF

2. Design of Micro Products

   1. Front Matter

      Pages 1-1

      PDF

   2. Methods of Design for Micro-Assembly

      1. Application of a DFμA Methodology to facilitate the assembly of a Micro/Nano Measurement Device

         • Carsten Tietje, Richard Leach, Michele Turitto, Ronaldo Ronaldo, Svetan Ratchev

         Pages 5-12

      2. A DFA Framework for Hybrid Microsystems

         • Marcel Tichem, Dafina Tanase

         Pages 13-22

      3. Statistical Assemblies with form Errors — A 2D Example

         • Pierre-Antoine Adragna, Hugues Favrelière, Serge Samper, Maurice Pillet

         Pages 23-33

   3. Methods and Solutions for Micro-Product Design

      1. A Classification and Coding System for Micro-Assembly

         • Amar Kumar Behera, Shiv G. Kapoor, Richard E. DeVor

         Pages 37-53

      2. A Method for Three Dimensional Tolerance Analysis and Synthesis Applied to Complex and Precise Assemblies

         • Frédéric Germain, Dimitri Denimal, Max Giordano

         Pages 55-65

      3. New Designs for Submillimetric Press-Fitting

         • Ludovic Charvier, Fabien Bourgeois, Jacques Jacot, Grégoire Genolet, Hubert Lorenz

         Pages 67-74

      4. Design and Testing of an Ortho-Planar Micro-Valve

         • O. Smal, B. Raucent, F. Ceyssens, R. Puers, M. De Volder, D. Reynaerts

         Pages 75-86

      5. Robust Design of a Lens System of Variable Refraction Power with Respect to the Assembly Process

         • Ingo Sieber, Ulrich Gengenbach, Rudolf Scharnowell

         Pages 87-93

3. Micro-Assembly Processes and Applications

   1. Front Matter

      Pages 95-95

      PDF

   2. Process Modelling for Micro-Assembly

      1. Product-Process Ontology for Managing Assembly Specific Knowledge Between Product Design and Assembly System Simulation

         • Minna Lanz, Fernando Garcia, Timo Kallela, Reijo Tuokko

         Pages 99-108

      2. Bridging the Gap — from Process Related Documentation to an Integrated Process and Application Knowledge Management in Micro Systems Technology

         • Markus Dickerhof, Anna Parusel

         Pages 109-119

      3. Distributed Simulation in Manufacturing Using High Level Architecture

         • J. Rodríguez Alvarado, R. Vélez Osuna, R. Tuokko

         Pages 121-126

   3. High Precision Packaging and Assembly Processes

      1. Adaptive Packaging Solution for a Microlens Array Placed Over a Micro-UV-LED Array

         • Markus Luetzelschwab, Dominik Weiland, Marc P. Y. Desmulliez

         Pages 129-138

      2. Solder Bumping — A Flexible Joining Approach for the Precision Assembly of Optoelectronical Systems

         • Erik Beckert, Thomas Burkhardt, Ramona Eberhardt, Andreas Tünnermann

         Pages 139-147

      3. Fluidassem - A New Method of Fluidic-Based Assembly with Surface Tension

         • N. Boufercha, J. Sägebarth, M. Burgard, N. Othman, D. Schlenker, W. Schäfer et al.

         Pages 149-159

      4. Concepts for Hybrid Micro Assembly Using Hot Melt Joining

         • Sven Rathmann, Annika Raatz, Jürgen Hesselbach

         Pages 161-169

      5. Application of Microstereolithography Technology in Micromanufacturing

         • Hongyi Yang, Gregory Tsiklos, Ronaldo Ronaldo, Svetan Ratchev

         Pages 171-176

      6. In Situ Microassembly

         • Ronaldo Ronaldo, Thomas Papastathis, Hongyi Yang, Carsten Tietje, Michele Turitto, Svetan Ratchev

         Pages 177-185

Micro-assembly is a key enabling technology for cost effective manufacture of new generations of complex micro products. It is also a critical technology for retaining mdustrial capabilities in high labour cost areas such as Europe since up to 80% of the production cost in some industries is attributed directly to assembly processes. With the continuous trend for product miniaturisation, the scientific and technologi­ cal developments in micro-assembly are expected to have a significant long-term economic, demographic and social impact. A distinctive feature of the process is that surface forces are often dominant over gravity forces, which determines a number of specific technical challenges. Critical areas which are currently being addressed include development of assembly systems with high positional accuracy, micro gripping methods that take into ac­ count the adhesive surface forces, high precision micro-feeding techniques and mi­ cro-joining processes. Micro-assembly has developed rapidly over the last few years and all the pre­ dictions are that it will remain a critical technology for high value products in a number of key sectors such as healthcare, communications, defence and aerospace. The key challenge is to match the significant technological developments with a new generation of micro products that will establish firmly micro-assembly as a core manufacturing process.

• artificial intelligence
• communication
• human-computer interaction (HCI)
• information system
• integrated circuit
• intelligence
• metal-oxide-semiconductor transistor
• optimization
• system modeling

• University of Nottingham, UK

  Svetan Ratchev

• École Polytechnique Fédérale de Lausanne, Switzerland

  Sandra Koelemeijer

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