Emerging Nanotechnologies

Test, Defect Tolerance, and Reliability

  • Mohammad Tehranipoor

Part of the Frontiers in Electronic Testing book series (FRET, volume 37)

Table of contents

  1. Front Matter
    Pages IX-X
  2. Test and Defect Tolerance for Crossbar-Based Architectures

  3. Test and Defect Tolerance for QCA Circuits

    1. Front Matter
      Pages 153-155
    2. X. Ma, J. Huang, C. Metra, F. Lombardi
      Pages 157-202
    3. S. Bhanja, M. Ottavi, S. Pontarelli, F. Lombardi
      Pages 227-249
  4. Testing Microfluidic Biochips

    1. Front Matter
      Pages 265-265
    2. F. Su, W. Hwang, A. Mukherjee, K. Chakrabarty
      Pages 287-312
  5. Reliability for Nanotechnology Devices

    1. Front Matter
      Pages 313-314
    2. K. Nepal, R. I. Bahar, J. Mundy, W. R. Patterson, A. Zaslavsky
      Pages 315-338
    3. W. Rao, A. Orailoglu, R. Karri
      Pages 339-372
    4. D. Bhaduri, S. K. Shukla, H. Quinn, P. Graham, M. Gokhale
      Pages 373-397
  6. Back Matter
    Pages 399-408

About this book

Introduction

Emerging Nanotechnologies: Test, Defect Tolerance and Reliability covers various technologies that have been developing over the last decades such as chemically assembled electronic nanotechnology, Quantum-dot Cellular Automata (QCA), and nanowires and carbon nanotubes. Each of these technologies offers various advantages and disadvantages. Some suffer from high power, some work in very low temperatures and some others need indeterministic bottom-up assembly. These emerging technologies are not considered as a direct replacement for CMOS technology and may require a completely new architecture to achieve their functionality.

Emerging Nanotechnologies: Test, Defect Tolerance and Reliability brings all of these issues together in one place for readers and researchers who are interested in this rapidly changing field.

Keywords

CMOS Nanotechnologie Nanotube Technologie carbon nanotubes circuit design diagnosis logic nanotechnology optimization planning reliability technology testing

Editors and affiliations

  • Mohammad Tehranipoor
    • 1
  1. 1.Department of Electrical and Computer EngineeringUniversity of ConnecticutStorrsUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-0-387-74747-7
  • Copyright Information Springer-Verlag US 2008
  • Publisher Name Springer, Boston, MA
  • eBook Packages Engineering
  • Print ISBN 978-0-387-74746-0
  • Online ISBN 978-0-387-74747-7
  • Series Print ISSN 0929-1296
  • About this book
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