© 2002

Electrothermal Analysis of VLSI Systems


Table of contents

  1. Front Matter
    Pages i-xxi
  2. The Building Blocks

  3. The Applications

  4. Back Matter
    Pages 203-210

About this book


Electrothermal Analysis of VLSI Systems addresses electrothermal problems in modern VLSI systems.
Part I, The Building Blocks, discusses electrothermal phenomena and the fundamental building blocks that electrothermal simulation requires (including power analysis, temperature-dependent device modeling, thermal/electrothermal simulation, and experimental setup-calibration).
Part II, The Applications, discusses three important applications of VLSI electrothermal analysis including temperature-dependent electromigration diagnosis, cell-level thermal placement and temperature-driven power and timing analysis.
Electrothermal Analysis of VLSI Systems will be useful for researchers in the fields of IC reliability analysis and physical design, as well as VLSI designers and graduate students.


CMOS VLSI calculus diagnosis integrated circuit modeling simulation tables

Authors and affiliations

  1. 1.Motorola, Inc.USA
  2. 2.University of Illinois at Urbana-ChampaignUSA
  3. 3.Silicon Perspective CorporationUSA

Bibliographic information

  • Book Title Electrothermal Analysis of VLSI Systems
  • Authors Yi-Kan Cheng
    Ching-Han Tsai
    Chin-Chi Teng
    Sung-Mo (Steve) Kang
  • DOI
  • Copyright Information Kluwer Academic Publishers 2002
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Hardcover ISBN 978-0-7923-7861-7
  • Softcover ISBN 978-1-4757-7373-6
  • eBook ISBN 978-0-306-47024-0
  • Edition Number 1
  • Number of Pages XXIII, 210
  • Number of Illustrations 36 b/w illustrations, 0 illustrations in colour
  • Topics Circuits and Systems
    Electrical Engineering
  • Buy this book on publisher's site
Industry Sectors
IT & Software
Energy, Utilities & Environment
Oil, Gas & Geosciences


From the Foreword:

`Continuing increases in the levels of circuit integration and concomitant increases in performance are sustaining the trend of increasing power dissipation in VLSI systems. A consequence is that the impact of temperature on the successful operation and reliability of devices must be comprehended during the design process.....This text provides a comprehensive formulation of the electrothermal analysis problem beginning with a summary of the sources of power dissipation in CMOS circuits and followed by a formulation of the effect of temperature on MOS devices.'
Dr. Ralph K. Cavin, Vice President, Semiconductor Research Corporation