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© 1989

Solder Paste in Electronics Packaging

Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly

Book

Table of contents

  1. Appendix

  2. Back Matter
    Pages 447-456

About this book

Introduction

One of the strongest trends in the design and manufacture of modern electronics packages and assemblies is the utilization of surface mount technology as a replacement for through-hole tech­ nology. The mounting of electronic devices and components onto the surface of a printed wiring board or other substrate offers many advantages over inserting the leads of devices or components into holes. From the engineering viewpoint, much higher lead counts with shorter wire and interconnection lengths can be accommo­ dated. This is critical in high performance modern electronics packaging. From the manufacturing viewpoint, the application of automated assembly and robotics is much more adaptable to high lead count surface mounted devices and components. Indeed, the insertion of high lead count parts into fine holes on a substrate might often be nearly impossible. Yet, in spite of these surface mounting advantages, the utilization of surface mount technology is often a problem, primarily due to soldering problems. The most practical soldering methods use solder pastes, whose intricacies are frequently not understood by most of those involved in the engineering and manufacture of electronics assemblies. This publication is the first book devoted exclusively to explanations of the broad combination of the chemical, metallurgical, and rheological principles that are critical to the successful use of solder pastes. The critical relation­ ships between these characteristics are clearly explained and pre­ sented. In this excellent presentation, Dr. Hwang highlights three impor­ tant areas of solder paste technology.

Keywords

assembly coating electronics laser manufacturing metals packaging

Authors and affiliations

  1. 1.SCM Metal Products, Inc.USA

Bibliographic information

  • Book Title Solder Paste in Electronics Packaging
  • Book Subtitle Technology and Applications in Surface Mount, Hybrid Circuits, and Component Assembly
  • Authors Jennie S. Hwang
  • DOI https://doi.org/10.1007/978-94-011-6050-6
  • Copyright Information Springer Science+Business Media B.V. 1989
  • Publisher Name Springer, Dordrecht
  • eBook Packages Springer Book Archive
  • Hardcover ISBN 978-0-442-20754-0
  • Softcover ISBN 978-94-011-6052-0
  • eBook ISBN 978-94-011-6050-6
  • Edition Number 1
  • Number of Pages XXIV, 456
  • Number of Illustrations 0 b/w illustrations, 0 illustrations in colour
  • Topics Science, Humanities and Social Sciences, multidisciplinary
  • Buy this book on publisher's site