Skip to main content
SpringerLink
Log in

Diffusion Bonding 2

  • Book
  • © 1991

Overview

Editors:
  1. D. J. Stephenson

    1. School of Industrial and Manufacturing Science, Cranfield Institute of Technology, UK

    View editor publications

    You can also search for this editor in PubMed   Google Scholar

This is a preview of subscription content, log in via an institution to check access.

Access this book

Log in via an institution
eBook USD 79.99
Price excludes VAT (USA)
  • Available as EPUB and PDF
  • Read on any device
  • Instant download
  • Own it forever
Hardcover Book USD 99.99
Price excludes VAT (USA)
  • Durable hardcover edition
  • Dispatched in 3 to 5 business days
  • Free shipping worldwide - see info

Tax calculation will be finalised at checkout

Other ways to access

Licence this eBook for your library

Institutional subscriptions

Table of contents (25 chapters)

  1. General Applications

    1. The Application of SPF/DB to Dissimilar Metal Joints

      • P. G. Partridge, T. S. Baker
      Pages 242-249

    2. HIP-diffusion bonding of ODS-materials by use of plasma sprayed encapsulation

      • K. H. Hammelmann, H. P. Buchkremer, D. Stöver
      Pages 250-260

    3. Component Assembly Using HIP Diffusion Bonding

      • R. M. Walker, D. J. Roberts, B. A. Rickinson
      Pages 261-269

    4. Diffusion Bonded Windows for Diagnostics of Fusion Plasmas

      • H. J. Milton, A. A. Newton, H. H. H. Watson
      Pages 270-292

    5. Low Temperature Diffusion Bonding of High Carat Gold Using in Situ Gold-Cadmium Alloys

      • D. Decroupet, G. Demortier
      Pages 293-301

    6. A New Aspect of Eutectic Bonding for Gold Soldering

      • S. Mathot, G. Demortier
      Pages 302-316
Back to top

Keywords

About this book

There is currently great interest in the process of diffusion bonding. The main thrust has been in the joining of advanced materials such as superplastic alloys, metal matrix composites and ceramics and, most importantly, to introduce the process into mass-production operations. Diffusion bonding has also led to reduced manufacturing costs and weight savings in conventional materials and developments in hot isostatic pressing have allowed greater design flexibility. Since the first conference on Diffusion Bonding, held at Cranfield in 1987, considerable advances have been made and it was therefore considered appropriate to organise the Second International Conference on Diffusion Bonding which was held at Cranfield Institute of Technology on 28 and 29 March 1990. The meeting provided a forum for the presentation and discussion of recent developments in Diffusion Bonding and was divided into four main subject areas: steel bonding and quality control, diffusion bonding of aluminium alloys, bonding of high temperature materials and general applications. This structure is retained in the proceedings. DAVID STEPHENSON vii CONTENTS v Preface ......................... .

Editors and Affiliations

  • School of Industrial and Manufacturing Science, Cranfield Institute of Technology, UK

    D. J. Stephenson

Bibliographic Information

Publish with us

Policies and ethics

Back to top

Search

Navigation