© 1991

Electronics Packaging Forum

Volume Two

  • James E. Morris

Table of contents

  1. Front Matter
    Pages i-viii
  2. John H. Lau, Steve J. Erasmus, Donald W. Rice
    Pages 1-83
  3. Craig D. Smith
    Pages 139-181
  4. Richard C. Chu, Robert E. Simons
    Pages 183-208
  5. Gary L. Lehmann
    Pages 209-228
  6. Lynn Sui-Yuan, D. Garg, D. S. Hoover
    Pages 229-245
  7. George R. Westby, Michael D. Snyder
    Pages 395-436
  8. Back Matter
    Pages 451-459

About this book


Each May, the Continuing Education Division of the T.J.Watson School of Engineering, Applied Science and Technology at the State University of New York at Binghamton sponsors an Annual Symposium in Electronics Packaging in cooperation with local professional societies (IEEE, ASME, SME, IEPS) and UnlPEG (the University-Industry Partnership for Economic Growth.) Each volume of this Electronics Packaging Forum series is based on the the preceding Symposium, with Volume Two based on the 1990 presentations. The Preface to Volume One included a brief definition of the broad scope of the electronics packaging field with some comments on why it has recently assumed such a more prominent priority for research and development. Those remarks will not be repeated here; at this point it is assumed that the reader is a professional in the packaging field, or possibly a student of one of the many academic disciplines which contribute to it. It is worthwhile repeating the series objectives, however, so the reader will be clear as to what might be expected by way of content and level of each chapter.


circuit development electrical overstress (EOS) electronics heat material photon

Editors and affiliations

  • James E. Morris
    • 1
  1. 1.State University of New YorkBinghamtonUSA

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