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© 2015

Carbon Nanotube Based VLSI Interconnects

Analysis and Design

Benefits

  • Introduces carbon nanotube basics in lucid manner

  • Discusses applications of carbon nanotube as VLSI interconnects

  • Details modeling of CNTs as interconnects

Book

Part of the SpringerBriefs in Applied Sciences and Technology book series (BRIEFSAPPLSCIENCES)

Table of contents

  1. Front Matter
    Pages i-xi
  2. Brajesh Kumar Kaushik, Manoj Kumar Majumder
    Pages 1-15
  3. Brajesh Kumar Kaushik, Manoj Kumar Majumder
    Pages 17-37
  4. Brajesh Kumar Kaushik, Manoj Kumar Majumder
    Pages 39-56
  5. Brajesh Kumar Kaushik, Manoj Kumar Majumder
    Pages 57-68
  6. Brajesh Kumar Kaushik, Manoj Kumar Majumder
    Pages 69-77
  7. Back Matter
    Pages 79-86

About this book

Introduction

The brief primarily focuses on the performance analysis of CNT based interconnects in current research scenario. Different CNT structures are modeled on the basis of transmission line theory. Performance comparison for different CNT structures illustrates that CNTs are more promising than Cu or other materials used in global VLSI interconnects. The brief is organized into five chapters which mainly discuss: (1) an overview of current research scenario and basics of interconnects; (2) unique crystal structures and the basics of physical properties of CNTs, and the production, purification and applications of CNTs; (3) a brief technical review, the geometry and equivalent RLC parameters for different single and bundled CNT structures; (4) a comparative analysis of crosstalk and delay for different single and bundled CNT structures; and (5) various unique mixed CNT bundle structures and their equivalent electrical models.

Keywords

Carbon Nanotube Delay and Signal Integrity Mixed Carbon Nanotube Bundle Modeling Types of Interconnects VLSI Design

Authors and affiliations

  1. 1.Electronics and Communication EnggIndian Institute of Technology RoorkeeRoorkeeIndia
  2. 2.Department of Electronics & Communication EngineeringIndian Institute of Technology RoorkeeRoorkeeIndia

About the authors

Brajesh Kumar Kaushik is currently working as Associate Professor in Department of Electronics and Communication Engineering, Indian Institute of Technology Roorkee, Roorkee, India. Dr. Kaushik has completed his PhD from Indian Institute of Technology Roorkee in 2007. His research interests include Signal Integrity, Propagation Delay, and Power Dissipation of VLSI Interconnects; Low Power VLSI Design; Electronic Design Automation (EDA)-Circuit and Systems-CAD. Dr. Kaushik has authored more than 60 papers in peer reviewed international journals and over 80 papers in international Conferences. He has also authored many book chapters, which includes 3 chapters in Springer books. Dr. Kaushik is also an Editor-in-Chief of VLSI Design & Communication System (VLSICS) and Editor of Journal of Electrical and Electronics Engineering Research (JEEER), Academic Journals and Journal of Engineering, Design and Technology (JEDT), Emerald.

Manoj Kumar Majumder, Research Scholar, is currently pursuing his PhD from Indian Institute of Technology, Roorkee, India. Prior to this, he completed his BTech from Dr. B. C. Roy Engineering College, Durgapur in 2007 and M.Tech from Bengal Engineering and Science University, Shibpur in 2009. He has also worked as lecturer in Department of Electronics and Communication Engineering at Durgapur Institute of Advanced Technology and Management (DIATM), West Bengal. He has one book chapter and several journal and conference publications to his credit.

Bibliographic information

  • Book Title Carbon Nanotube Based VLSI Interconnects
  • Book Subtitle Analysis and Design
  • Authors Brajesh Kumar Kaushik
    Manoj Kumar Majumder
  • Series Title SpringerBriefs in Applied Sciences and Technology
  • Series Abbreviated Title SpringerBriefs in Applied Sciences
  • DOI https://doi.org/10.1007/978-81-322-2047-3
  • Copyright Information The Author(s) 2015
  • Publisher Name Springer, New Delhi
  • eBook Packages Engineering Engineering (R0)
  • Softcover ISBN 978-81-322-2046-6
  • eBook ISBN 978-81-322-2047-3
  • Series ISSN 2191-530X
  • Series E-ISSN 2191-5318
  • Edition Number 1
  • Number of Pages XI, 86
  • Number of Illustrations 57 b/w illustrations, 0 illustrations in colour
  • Topics Nanotechnology and Microengineering
    Circuits and Systems
    Optical and Electronic Materials
  • Buy this book on publisher's site
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