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Investigations on Microstructure and Mechanical Properties of the Cu/Pb-free Solder Joint Interfaces

  • Qingke Zhang
Book

Part of the Springer Theses book series (Springer Theses)

Table of contents

  1. Front Matter
    Pages i-xv
  2. Qingke Zhang
    Pages 1-33
  3. Qingke Zhang
    Pages 141-143

About this book

Introduction

This thesis presents a series of mechanical test methods and comprehensively investigates the deformation and damage behavior of Cu/Pb-free solder joints under different loading conditions. The fracture behavior of Pb-free joint interfaces induced by stress, deformation of solder and substrate are shown, the shear fracture strength of the Cu6Sn5 IMC is measured experimentally for the first time, and the dynamic damage process and microstructure evolution behavior of Pb-free solder joints are revealed intuitively. The thesis puts forward the argument that the local cumulative damage is the major cause of failure in solder joints. The research results provide the experimental and theoretical basis for improving the reliability of solder joints.

Keywords

Creep fatigue Fatigue crack In situ Characterization Lead-free solder joints Tension-compression fatigue Thermal fatigue

Authors and affiliations

  • Qingke Zhang
    • 1
  1. 1.Zhengzhou Research Institute of Mechanical EngineeringZhengzhouChina

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-662-48823-2
  • Copyright Information Springer-Verlag Berlin Heidelberg 2016
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Engineering Engineering (R0)
  • Print ISBN 978-3-662-48821-8
  • Online ISBN 978-3-662-48823-2
  • Series Print ISSN 2190-5053
  • Series Online ISSN 2190-5061
  • Buy this book on publisher's site
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