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© 2004

Wafer Bonding

Applications and Technology

  • Marin Alexe
  • Ulrich Gösele
  • Presents the current state of the art in wafer bonding - a technology important to microelectronic device manufacturing

Book

Part of the Springer Series in MATERIALS SCIENCE book series (SSMATERIALS, volume 75)

Table of contents

  1. Front Matter
    Pages I-XV
  2. G. K. Celler, A. J. Auberton-Hervé, B. Aspar, C. Lagahe-Blanchard, C. Maleville
    Pages 85-105
  3. K. Sakaguchi, T. Yonehara
    Pages 107-156
  4. K. W. Guarini, H.-S. P. Wong
    Pages 157-191
  5. T. D. Sands, W. S. Wong, N. W. Cheung
    Pages 377-415
  6. M. Levy, A. M. Radojevic
    Pages 417-450
  7. M. Alexe, I. Radu, I. Szafraniak
    Pages 451-471
  8. Back Matter
    Pages 495-503

About this book

Introduction

During the past decade direct wafer bonding has developed into a mature materials integration technology. This book presents state-of-the-art reviews of the most important applications of wafer bonding written by experts from industry and academia. The topics include bonding-based fabrication methods of silicon-on-insulator, photonic crystals, VCSELs, SiGe-based FETs, MEMS together with hybrid integration and laser lift-off. The non-specialist will learn about the basics of wafer bonding and its various application areas, while the researcher in the field will find up-to-date information about this fast-moving area, including relevant patent information.

Keywords

Compound semiconductors Diode Helium-Atom-Streuung MEMS Semiconductor Silicon-on-insulator Wafer Wafer bonding basics crystal integrated circuit logic optoelectronics semiconductors

Editors and affiliations

  • Marin Alexe
    • 1
  • Ulrich Gösele
    • 1
  1. 1.Max-Planck Institute of Microstructure PhysicsHalle (Saale)Germany

Bibliographic information

Industry Sectors
Energy, Utilities & Environment

Reviews

From the reviews:

"Wafer bonding, also known as direct wafer bonding or wafer fusion, has developed from an almost obscure niche technology in the 1980s … . Anyone interested in learning about the basics of wafer bonding and its various application areas, will likely be served by this outstanding volume while the researcher engaged in studies on applied and technological aspects of wafer bonding, will find up-to-date information about this fast-moving area, including relevant patent information." (Current Engineering Practice, Vol. 47 (3), 2004 - 2005)