Silicon Microchannel Heat Sinks

Theories and Phenomena

  • Lian Zhang
  • Kenneth E. Goodson
  • Thomas W. Kenny

Part of the Microtechnology and MEMS book series (MEMS)

Table of contents

  1. Front Matter
    Pages I-IX
  2. Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 1-11
  3. Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 13-32
  4. Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 33-54
  5. Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 55-72
  6. Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 73-94
  7. Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 95-118
  8. Lian Zhang, Kenneth E. Goodson, Thomas W. Kenny
    Pages 119-125
  9. Back Matter
    Pages 127-141

About this book

Introduction

Two-phase microchannel cooling is one of the most promising thermal-management technologies for future high-power IC chips. Understanding the boiling process and the two-phase flow behavior in microchannels is the key to successful implementation of a microchannel heat sink. This book focuses on the phase-change phenomena and the heat transfer in sub-150 mm diameter silicon microchannels, with emphasis on thermal measurement and modeling, and the impact of small dimensions on two-phase flow regimes. Scientists and engineers tackling thermal and MEMS problems will find the discussion in this book inspiring for their future design of microscale heat transfer experiments. This book will also contribute to the study of two-phase microchannel flows by providing extensive experimental data which are otherwise barely available.

Keywords

Cooling Heat sink Microchannel Nucleation Two-phase heat transfer integrated circuit

Authors and affiliations

  • Lian Zhang
    • 1
  • Kenneth E. Goodson
    • 2
  • Thomas W. Kenny
    • 3
  1. 1.Molecular NanosystemsPalo AltoUSA
  2. 2.Department of Mechanical EngineeringStanford UniversityStanfordUSA
  3. 3.Department of Mechanical EngineeringStanford UniversityStanfordUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-662-09899-8
  • Copyright Information Springer-Verlag Berlin Heidelberg 2004
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Springer Book Archive
  • Print ISBN 978-3-642-07282-6
  • Online ISBN 978-3-662-09899-8
  • Series Print ISSN 1615-8326
  • About this book
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