Advertisement

Ultraclean Surface Processing of Silicon Wafers

Secrets of VLSI Manufacturing

  • Takeshi¬†Hattori

Table of contents

  1. Front Matter
    Pages I-XXVIII
  2. Introduction

    1. Front Matter
      Pages 1-1
  3. Influence of Contamination on Silicon Device Characteristics

  4. Mechanisms of Particle Adhesion on Wafer Surfaces

    1. Front Matter
      Pages 65-65
    2. Motoaki Adachi, Kikuo Okuyama
      Pages 67-81
    3. Motoaki Adachi, Kikuo Okuyama
      Pages 82-91
    4. Tetsuro Kodama
      Pages 92-104
    5. Akio Saito, Katsuhiro Ota
      Pages 105-114
    6. Mitsushi Itano, Takehiko Kezuka
      Pages 115-136
  5. Analysis and Evaluation of Silicon Wafer Surfaces: Fundamentals

  6. Analysis and Evaluation of Wafer Surfaces: Applications to Semiconductor Manufacturing Lines

    1. Front Matter
      Pages 241-241
    2. Yoshiki Suzuki
      Pages 259-270
    3. Kenji Yoneda
      Pages 271-285
  7. Ultraclean Technology for Wafer Processes and Equipment

    1. Front Matter
      Pages 303-303
    2. Kikuo Yamabe
      Pages 305-316
    3. Masashi Asami
      Pages 331-341
    4. Makoto Sekine
      Pages 342-351
    5. Tsuyoshi Takahashi
      Pages 352-360
    6. Yasutsugu Usami
      Pages 384-397
    7. Fumio Mizuno
      Pages 398-413
    8. CMP
      Yoshihiro Hayashi
      Pages 414-425
    9. Atsuyoshi Koike
      Pages 426-434
  8. Cleaning Silicon Wafer Surfaces

    1. Front Matter
      Pages 435-435
    2. Takeshi Hattori
      Pages 437-450
    3. E. Morita, H. Okuda, F. Inoue, K. Akiyama
      Pages 482-493
    4. Katsuhiko Itoh, Yoshio Saito
      Pages 494-502
    5. Kenji Sugimoto, Nobuyasu Hiraoka, Masahiro Nonomura
      Pages 508-513
    6. Takashi Ito
      Pages 514-528
  9. Wafer-Cleaning-Related Issues

    1. Front Matter
      Pages 529-529
    2. Tsutomu Takeuchi, Akira Izumi
      Pages 531-542

About this book

Introduction

The contamination of wafer surfaces with particles arising from the processing equipment is the main reason for yield losses in the manufacturing of VLSI devices. The starting point for the control of contamination must be the surface of the wafer itself and not just the reduction of contamination in the ambient air or in the gases, chemicals and water used for production. A totally new concept for clean surface processing is introduced here. Some fifty distinguished researchers and engineers from the leading Japanese semiconductor companies, such as NEC, Hitachi, Toshiba, Sony and Panasonic, as well as from several universities reveal to us for the first time the secrets of these highly productive institutions. They describe the techniques and equipment necessary for the preparation of clean high-quality semiconductor surfaces as a first step in high-yield/high-quality device production. This book thus opens the door to the manufacturing of reliable nanoscale devices and will be extremely useful for every engineer, physicist and technician involved in the production of silicon semiconductor devices.

Keywords

Technologie VLSI production quality semiconductor devices

Editors and affiliations

  • Takeshi¬†Hattori
    • 1
  1. 1.ULSI R&D LaboratoriesSony Corporation Semiconductor CompanyAtsugiJapan

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-662-03535-1
  • Copyright Information Springer-Verlag Berlin Heidelberg 1998
  • Publisher Name Springer, Berlin, Heidelberg
  • eBook Packages Springer Book Archive
  • Print ISBN 978-3-642-08272-6
  • Online ISBN 978-3-662-03535-1
  • Buy this book on publisher's site
Industry Sectors
Pharma
Automotive
Chemical Manufacturing
Biotechnology
Finance, Business & Banking
Electronics
IT & Software
Telecommunications
Consumer Packaged Goods
Aerospace
Oil, Gas & Geosciences
Engineering