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Semiconductor Power Devices

Physics, Characteristics, Reliability

  • Josef Lutz
  • Heinrich Schlangenotto
  • Uwe Scheuermann
  • Rik De Doncker
Book

Table of contents

  1. Front Matter
    Pages i-xii
  2. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 1-15
  3. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 17-75
  4. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 77-121
  5. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 123-157
  6. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 159-224
  7. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 225-240
  8. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 241-256
  9. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 257-282
  10. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 283-314
  11. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 315-342
  12. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 343-418
  13. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 419-473
  14. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 475-495
  15. Josef Lutz, Heinrich Schlangenotto, Uwe Scheuermann, Rik De Doncker
    Pages 497-513
  16. Back Matter
    Pages 515-536

About this book

Introduction

Semiconductor power devices are the heart of power electronics. They determine the performance of power converters and allow topologies with high efficiency. Semiconductor properties, pn-junctions and the physical phenomena for understanding power devices are discussed in depth. Working principles of state-of-the-art power diodes, thyristors, MOSFETs and IGBTs are explained in detail, as well as key aspects of semiconductor device production technology. In practice, not only the semiconductor, but also the thermal and mechanical properties of packaging and interconnection technologies are essential to predict device behavior in circuits. Wear and aging mechanisms are identified and reliability analyses principles are developed. Unique information on destructive mechanisms, including typical failure pictures, allows assessment of the ruggedness of power devices. Also parasitic effects, such as device induced electromagnetic interference problems, are addressed. The book concludes with modern power electronic system integration techniques and trends.

Keywords

Fast Diodes IGBT MOFSET Packaging Technology

Authors and affiliations

  • Josef Lutz
    • 1
  • Heinrich Schlangenotto
    • 2
  • Uwe Scheuermann
    • 3
  • Rik De Doncker
    • 4
  1. 1.Fak. Elektrotechnik und, InformationstechnikTU ChemnitzChemnitzGermany
  2. 2.Neu-IsenburgGermany
  3. 3.Semikron Elektronik GmbH & Co. KGNürnbergGermany
  4. 4.Inst. Power Electronics & Electr. Drives, (ISEA)RWTH Aachen UniversityAachenGermany

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