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Nanopackaging

Nanotechnologies and Electronics Packaging

  • James E. Morris

Table of contents

  1. Front Matter
    Pages i-xxviii
  2. Chris Bailey, Stoyan Stoyanov, Hua Lu, Tim Tilford, Chunyan Yin, Nadia Strusevich
    Pages 45-82
  3. Olaf van der Sluis, Bart Vossen, Jan Neggers, Andre Ruybalid, Karthik Chockalingam, Ron Peerlings et al.
    Pages 83-128
  4. Olaf van der Sluis, Nancy Iwamoto, Jianmin Qu, Shaorui Yang, Cadmus Yuan, Willem D. van Driel et al.
    Pages 129-183
  5. Yinsheng Zhong, Stephen C. T. Kwok, Matthew M. F. Yuen
    Pages 185-200
  6. James E. Morris
    Pages 201-217
  7. Masahiro Inoue, Yamato Hayashi, Hirotsugu Takizawa, Katsuaki Suganuma
    Pages 219-242
  8. A. Dabrowski, Andrzej Dziedzic, Jiongxin Lu, C. P. Wong
    Pages 243-268
  9. Damian Nowak, Andrzej Dziedzic, Fan Wu, James E. Morris
    Pages 269-310
  10. P. Markondeya Raj, Gopal C. Jha, Sun Teng, Himani Sharma, Swapan K. Bhattacharya, Rao R. Tummala
    Pages 311-343
  11. Daoqiang Daniel Lu, Yi Grace Li, C. P. Wong, James E. Morris
    Pages 345-367
  12. Kyung-Wook Paik, Kyung-Lim Suk
    Pages 369-408
  13. Rabindra N. Das, Frank D. Egitto
    Pages 409-437
  14. Pradeep Lall, Saiful Islam, Kalyan Dornala, Jeff Suhling, Darshan Shinde
    Pages 513-574
  15. Nandhinee Radha Shanmugam, Shalini Prasad
    Pages 575-596
  16. Nandhinee Radha Shanmugam, Shalini Prasad
    Pages 597-628
  17. K. Mohan Kumar, Vaidyanathan Kripesh, Andrew A. O. Tay
    Pages 649-676
  18. Stefan Fiedler, Michael Zwanzig, Ralf Schmidt, Wolfgang Scheel
    Pages 677-700
  19. Kafil M. Razeeb, Jing Tao, Frank Stam
    Pages 701-723
  20. Antonio Maffucci
    Pages 725-774
  21. Johan Liu, Teng Wang
    Pages 775-791
  22. Chenglung Chung, Yuchun Chen, Yinren Chen, Yonhua Tzeng
    Pages 793-804
  23. Wai-Leong Chen, Dong-Ming Wu, Yinren Chen, Yonhua Tzeng
    Pages 805-822
  24. Hoda Malekpour, Alexander A. Balandin
    Pages 823-865
  25. Lunyu Ma, Suresh K. Sitaraman, Qi Zhu, Kevin Klein, David Fork
    Pages 867-891
  26. James E. Morris
    Pages 893-905
  27. Debendra Mallik, Ravi Mahajan, Nachiket Raravikar, Kaladhar Radhakrishnan, Kemal Aygun, Bob Sankman
    Pages 921-956
  28. Walt Trybula, Deb Newberry, Dominick Fazarro
    Pages 957-973
  29. Back Matter
    Pages 975-996

About this book

Introduction

This book presents a comprehensive overview of nanoscale electronics and systems packaging, and covers nanoscale structures, nanoelectronics packaging, applications of nanoparticles, graphene, carbon nanotubes and nanowires in packaging, and offers a roadmap for future trends. Composite materials are studied for high-k dielectrics, resistors and inductors, electrically conductive adhesives, conductive “inks,” underfill fillers, and solder enhancement.

Now in a second edition, Nanopackaging is an important reference for industrial and academic researchers, as well as practicing engineers seeking information about latest techniques. 12 new chapters address carbon nanotubes and nanowires, fabrication and properties of graphene, graphene for thermal cooling of microelectronics and for electrical interconnections, packaging of post-CMOS nanoelectronics, environmental and health effects of nanopackaging technologies, and more. This book is an ideal reference for researchers, practicing engineers, and graduate students who are either entering the field for the first time, or are already conducting research and want to expand their knowledge in the field of nanopackaging.

Keywords

Nanoelectronics Nanomaterials Carbon nanotubes Nanocomposite resistors Nanoparticle fabrication Conductive Microstructures Thermal Cooling and Management

Editors and affiliations

  • James E. Morris
    • 1
  1. 1.Department of Electrical and Computer EngineeringPortland State UniversityPortlandUSA

Bibliographic information

Industry Sectors
Materials & Steel
Chemical Manufacturing
Biotechnology
Electronics
Consumer Packaged Goods
Oil, Gas & Geosciences
Engineering