3D Microelectronic Packaging

From Fundamentals to Applications

  • Yan Li
  • Deepak Goyal

Part of the Springer Series in Advanced Microelectronics book series (MICROELECTR., volume 57)

Table of contents

  1. Front Matter
    Pages i-ix
  2. Yan Li, Deepak Goyal
    Pages 1-15
  3. Ravi Mahajan, Bob Sankman
    Pages 17-46
  4. Praveen Kumar, Indranath Dutta, Zhiheng Huang, Paul Conway
    Pages 47-69
  5. Praveen Kumar, Indranath Dutta, Zhiheng Huang, Paul Conway
    Pages 71-99
  6. Hualiang Shi, Erasenthiran Poonjolai
    Pages 101-128
  7. Tadatomo Suga, Ran He, George Vakanas, Antonio La Manna
    Pages 129-155
  8. Kwang-Lung Lin
    Pages 205-222
  9. Satish G. Kandlikar, Amlan Ganguly
    Pages 245-260
  10. Yaodong Wang, Yingxia Liu, Menglu Li, K. N. Tu, Luhua Xu
    Pages 375-420
  11. Yan Li, Deepak Goyal
    Pages 421-459
  12. Back Matter
    Pages 461-463

About this book


This volume provides a comprehensive reference for graduate students and professionals in both academia and industry on the fundamentals, processing details, and applications of 3D microelectronic packaging, an industry trend for future microelectronic packages. Chapters written by experts cover the most recent research results and industry progress in the following areas: TSV, die processing, micro bumps, direct bonding, thermal compression bonding, advanced materials, heat dissipation, thermal management, thermal mechanical modeling, quality, reliability, fault isolation, and failure analysis of 3D microelectronic packages. Numerous images, tables, and didactic schematics are included throughout. This essential volume equips readers with an in-depth understanding of all aspects of 3D packaging, including packaging architecture, processing, thermal mechanical and moisture related reliability concerns, common failures, developing areas, and future challenges, providing insights into key areas for future research and development.

  • Provides comprehensive coverage of the state-of-the-art in 3D microelectronic packages
  • Covers advanced materials and processes, quality and reliability concerns, and fault isolation and failure analysis
  • Discusses 3D electronic package architecture and assembly process design
  • Features contributions from both academic and industry authors, for a complete view of this important technology


3D microelectronic packages Advanced materials in 3D packages Failure analysis microelectronic packaging Heat dissipation Metallic and polymeric packaging materials Micro bumps Quality and Reliability of 3D Packaging Solder connects in 3D packages TSV Processing and Reliability Through-silicon via

Editors and affiliations

  • Yan Li
    • 1
  • Deepak Goyal
    • 2
  1. 1.Intel CorporationChandlerUSA
  2. 2.Intel CorporationChandlerUSA

Bibliographic information

  • DOI
  • Copyright Information Springer International Publishing Switzerland 2017
  • Publisher Name Springer, Cham
  • eBook Packages Engineering Engineering (R0)
  • Print ISBN 978-3-319-44584-7
  • Online ISBN 978-3-319-44586-1
  • Series Print ISSN 1437-0387
  • Series Online ISSN 2197-6643
  • Buy this book on publisher's site
Industry Sectors
Materials & Steel
Chemical Manufacturing
Consumer Packaged Goods
Energy, Utilities & Environment
Oil, Gas & Geosciences