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Ultra-Low-Power Short-Range Radios

  • Patrick P. Mercier
  • Anantha P. Chandrakasan

Part of the Integrated Circuits and Systems book series (ICIR)

Table of contents

  1. Front Matter
    Pages i-xii
  2. Dhongue Lee, Patrick P. Mercier
    Pages 1-23
  3. David B. Smith, Leif W. Hanlen
    Pages 25-55
  4. Jagdish Pandey, Brian Otis
    Pages 57-95
  5. Phillip M. Nadeau, Arun Paidimarri, Patrick P. Mercier, Anantha P. Chandrakasan
    Pages 97-135
  6. Nathan E. Roberts, David D. Wentzloff
    Pages 137-162
  7. Gangadhar Burra, Srinath Hosur, Subhashish Mukherjee, Ashish Lachhwani, Sankar Debnath
    Pages 163-208
  8. Patrick P. Mercier, Denis C. Daly, Fred S. Lee, David D. Wentzloff, Anantha P. Chandrakasan
    Pages 233-280
  9. Hyungwoo Lee, Seong-Jun Song, Namjun Cho, Joonsung Bae, Hoi-Jun Yoo
    Pages 281-311
  10. Mehdi Kiani, Maysam Ghovanloo
    Pages 313-341
  11. Patrick P. Mercier, Anantha P. Chandrakasan
    Pages 343-375
  12. Saurav Bandyopadhyay, Yogesh K. Ramadass
    Pages 377-394

About this book

Introduction

This book explores the design of ultra-low-power radio-frequency integrated circuits (RFICs), with communication distances ranging from a few centimeters to a few meters. Such radios have unique challenges compared to longer-range, higher-powered systems.
As a result, many different applications are covered, ranging from body-area networks to transcutaneous implant communications and Internet-of-Things devices. A mix of introductory and cutting-edge design techniques and architectures which facilitate each of these applications are discussed in detail. Specifically, this book covers:


Keywords

Body-area Networks FBAR-based Transceivers Internet-of-Things Pulsed Ultra-wideband Radios Radio Frequency Integrated Circuits Radios for Medical Implants Superregenerative Radios Ultra-Low-Power Short-Range Radios Ultra-Low-Power Wake-up Radios

Editors and affiliations

  • Patrick P. Mercier
    • 1
  • Anantha P. Chandrakasan
    • 2
  1. 1.University of California, San DiegoLa JollaUSA
  2. 2.Massachusetts Institute of TechnologyCambridgeUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-319-14714-7
  • Copyright Information Springer International Publishing Switzerland 2015
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-319-14713-0
  • Online ISBN 978-3-319-14714-7
  • Series Print ISSN 1558-9412
  • Buy this book on publisher's site
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