Advanced Thermal Stress Analysis of Smart Materials and Structures

  • Zengtao Chen
  • Abdolhamid Akbarzadeh

Part of the Structural Integrity book series (STIN, volume 10)

Table of contents

  1. Front Matter
    Pages i-x
  2. Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 1-22
  3. Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 23-63
  4. Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 65-117
  5. Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 119-170
  6. Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 171-242
  7. Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 243-302
  8. Zengtao Chen, Abdolhamid Akbarzadeh
    Pages 303-304

About this book


This is the first single volume monograph that systematically summarizes the recent progress in using non-Fourier heat conduction theories to deal with the multiphysical behaviour of smart materials and structures. 

The book contains six chapters and starts with a brief introduction to Fourier and non-Fourier heat conduction theories. Non-Fourier heat conduction theories include Cattaneo-Vernotte, dual-phase-lag (DPL), three-phase-lag (TPL), fractional phase-lag, and nonlocal phase-lag heat theories. Then, the fundamentals of thermal wave characteristics are introduced through reviewing the methods for solving non-Fourier heat conduction theories and by presenting transient heat transport in representative homogeneous and advanced heterogeneous materials. The book  provides the fundamentals of smart materials and structures, including the background, application, and governing equations. In particular, functionally-graded smart structures made of piezoelectric, piezomagnetic, and magnetoelectroelastic materials are introduced as they represent the recent development in the industry.

A series of uncoupled thermal stress analyses on one-dimensional structures are also included. The volume ends with coupled thermal stress analyses of one-dimensional homogenous and heterogeneous smart piezoelectric structures considering different coupled thermopiezoelectric theories. Last but not least, fracture behavior of smart structures under thermal disturbance is investigated and the authors propose directions for future research on the topic of multiphysical analysis of smart materials.      


Non-Fourier heat conduction Thermal stress analysis Smart materials and structures Fracture mechanics Partial differential equations

Authors and affiliations

  • Zengtao Chen
    • 1
  • Abdolhamid Akbarzadeh
    • 2
  1. 1.Department of Mechanical EngineeringUniversity of AlbertaEdmontonCanada
  2. 2.Department of Bioresource EngineeringMcGill UniversityIsland of MontrealCanada

Bibliographic information

  • DOI
  • Copyright Information Springer Nature Switzerland AG 2020
  • Publisher Name Springer, Cham
  • eBook Packages Engineering Engineering (R0)
  • Print ISBN 978-3-030-25200-7
  • Online ISBN 978-3-030-25201-4
  • Series Print ISSN 2522-560X
  • Series Online ISSN 2522-5618
  • Buy this book on publisher's site
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