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Ageing of Integrated Circuits

Causes, Effects and Mitigation Techniques

  • Basel Halak
Book

Table of contents

  1. Front Matter
    Pages i-xiii
  2. Ageing Physical Mechanisms and Effects

  3. Ageing Mitigation Techniques

    1. Front Matter
      Pages 65-65
    2. Haider Muhi Abbas, Mark Zwolinski, Basel Halak
      Pages 67-89
    3. Mohd Syafiq Mispan, Mark Zwolinski, Basel Halak
      Pages 91-111
    4. Shengyu Duan, Mark Zwolinski, Basel Halak
      Pages 113-145
  4. Ageing Monitoring and Adaptation Techniques

    1. Front Matter
      Pages 147-147
    2. Lorena Anghel, Florian Cacho, Riddhi Jitendrakumar Shah
      Pages 149-180
    3. Helen-Maria Dounavi, Yiorgos Sfikas, Yiorgos Tsiatouhas
      Pages 181-210
    4. Gaole Sai, Mark Zwolinski, Basel Halak
      Pages 211-223
  5. Back Matter
    Pages 225-228

About this book

Introduction

This book provides comprehensive coverage of the latest research into integrated circuits’ ageing, explaining the causes of this phenomenon, describing its effects on electronic systems, and providing mitigation techniques to build ageing-resilient circuits.  

  • Describes in detail the physical mechanisms of CMOS ageing;
  • Provides an in-depth discussion on the impact of ageing on the performance and reliability of integrated circuits;
  • Presents state-of-the art synthesis algorithms for ageing resilient digital systems;
  • Introduces application-dependent techniques to mitigate the effects of aging;
  • Discusses the design and implementation of on-chip aging monitoring sensors for aging-adaptable systems;
  • Includes more than 200 references on state-of-art research in this area, providing direction for further reading.

Keywords

Analog IC Reliability Aging Effects on Integrated Circuits Aging-effects Mitigation in processor architectures Reliability Wearout Mechanisms Bias Temperature Instability

Editors and affiliations

  • Basel Halak
    • 1
  1. 1.The School of Electronics and Computer Science, University of SouthamptonSouthamptonUK

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-030-23781-3
  • Copyright Information Springer Nature Switzerland AG 2020
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-030-23780-6
  • Online ISBN 978-3-030-23781-3
  • Buy this book on publisher's site
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