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Circadian Rhythms for Future Resilient Electronic Systems

Accelerated Active Self-Healing for Integrated Circuits

  • Xinfei Guo
  • Mircea R. Stan
Book

Table of contents

  1. Front Matter
    Pages i-xix
  2. Overview

    1. Front Matter
      Pages 1-1
    2. Xinfei Guo, Mircea R. Stan
      Pages 3-14
  3. Experimental Validations

    1. Front Matter
      Pages 15-15
    2. Xinfei Guo, Mircea R. Stan
      Pages 57-75
  4. Implementing Self-healing on Chip

    1. Front Matter
      Pages 77-77
  5. Wearout and Recovery in Advanced Technology and Emerging Applications

    1. Front Matter
      Pages 141-141
  6. Summary and Closing Remarks

    1. Front Matter
      Pages 191-191
    2. Xinfei Guo, Mircea R. Stan
      Pages 193-197
  7. Back Matter
    Pages 199-208

About this book

Introduction

This book describes methods to address wearout/aging degradations in electronic chips and systems, caused by several physical mechanisms at the device level.  The authors introduce a novel technique called accelerated active self-healing, which fixes wearout issues by enabling accelerated recovery.  Coverage includes recovery theory, experimental results, implementations and applications, across multiple nodes ranging from planar, FD-SOI to FinFET, based on both foundry provided models and predictive models.  

  • Presents novel techniques, tested with experiments on real hardware;
  • Discusses circuit and system level wearout recovery implementations, many of these designs are portable and friendly to the standard design flow;
  • Provides circuit-architecture-system infrastructures that enable the accelerated self-healing for future resilient systems;
  • Discusses wearout issues at both transistor and interconnect level, providing solutions that apply to both;
  • Includes coverage of resilient aspects of emerging applications such as IoT.

Keywords

Circuit design for reliability CMOS devices and interconnect recovery Bias temperature instability for devices and circuits Electromigration Inside Logic Cells Reliability of Nanoscale Circuits and Systems

Authors and affiliations

  • Xinfei Guo
    • 1
  • Mircea R. Stan
    • 2
  1. 1.University of VirginiaCharlottesvilleUSA
  2. 2.University of VirginiaCharlottesvilleUSA

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-030-20051-0
  • Copyright Information Springer Nature Switzerland AG 2020
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-030-20050-3
  • Online ISBN 978-3-030-20051-0
  • Buy this book on publisher's site
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