© 2019

Systems-Level Packaging for Millimeter-Wave Transceivers


Part of the Smart Sensors, Measurement and Instrumentation book series (SSMI, volume 34)

Table of contents

  1. Front Matter
    Pages i-xv
  2. Mladen Božanić, Saurabh Sinha
    Pages 31-53
  3. Mladen Božanić, Saurabh Sinha
    Pages 55-104
  4. Mladen Božanić, Saurabh Sinha
    Pages 105-128
  5. Mladen Božanić, Saurabh Sinha
    Pages 129-156
  6. Mladen Božanić, Saurabh Sinha
    Pages 157-191
  7. Mladen Božanić, Saurabh Sinha
    Pages 193-227
  8. Mladen Božanić, Saurabh Sinha
    Pages 229-271

About this book


This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.


Internet of Things Integrated Circuits Millimeter-wave Devices Millimeter-wave Transmission Millimeter-wave Electronics System-on-package System-on-chip Transceivers Microwave Microelectronics Packaging system decision

Authors and affiliations

  1. 1.University of JohannesburgJohannesburgSouth Africa
  2. 2.Faculty of Engineering and the Built EnvironmentUniversity of JohannesburgJohannesburgSouth Africa

About the authors

Mladen Božanić (Ph.D, University of Pretoria), is a Senior IC Design Engineer responsible for mixed-mode design and design-for-test at Azoteq, South Africa and part-time researcher at the Department of Electrical and Electronic Engineering Science, University of Johannesburg. He is a Specialist Editor of South African Institute of Electrical Engineers (SAIEE) Africa Research Journal for the field of microelectronics and has authored or co-authored over 25 peer-reviewed contributions.

Prof Saurabh Sinha obtained his B.Eng, M.Eng, and Ph.D. degrees in Electronic Engineering from the University of Pretoria. As an established researcher, rated by the National Research Foundation (NRF), he has authored or co-authored over 110 publications in peer-reviewed journals and at international conferences. Prof Sinha is the Deputy Vice-Chancellor: Research and Internationalisation, University of Johannesburg. Prof Sinha served the 2014-2015 IEEE Board of Director and as IEEE Vice-President: Educational Activities.

Bibliographic information

  • Book Title Systems-Level Packaging for Millimeter-Wave Transceivers
  • Authors Mladen Božanić
    Saurabh Sinha
  • Series Title Smart Sensors, Measurement and Instrumentation
  • Series Abbreviated Title Smart Sensors, Measurement, Instrumentation
  • DOI
  • Copyright Information Springer Nature Switzerland AG 2019
  • Publisher Name Springer, Cham
  • eBook Packages Engineering Engineering (R0)
  • Hardcover ISBN 978-3-030-14689-4
  • Softcover ISBN 978-3-030-14692-4
  • eBook ISBN 978-3-030-14690-0
  • Series ISSN 2194-8402
  • Series E-ISSN 2194-8410
  • Edition Number 1
  • Number of Pages XV, 277
  • Number of Illustrations 0 b/w illustrations, 0 illustrations in colour
  • Topics Wireless and Mobile Communication
    Engineering Design
    Cyber-physical systems, IoT
  • Buy this book on publisher's site
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