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Systems-Level Packaging for Millimeter-Wave Transceivers

  • Mladen Božanić
  • Saurabh Sinha

Part of the Smart Sensors, Measurement and Instrumentation book series (SSMI, volume 34)

Table of contents

  1. Front Matter
    Pages i-xv
  2. Mladen Božanić, Saurabh Sinha
    Pages 31-53
  3. Mladen Božanić, Saurabh Sinha
    Pages 55-104
  4. Mladen Božanić, Saurabh Sinha
    Pages 105-128
  5. Mladen Božanić, Saurabh Sinha
    Pages 129-156
  6. Mladen Božanić, Saurabh Sinha
    Pages 157-191
  7. Mladen Božanić, Saurabh Sinha
    Pages 193-227
  8. Mladen Božanić, Saurabh Sinha
    Pages 229-271

About this book

Introduction

This book provides a system-level approach to making packaging decisions for millimeter-wave transceivers. In electronics, the packaging forms a bridge between the integrated circuit or individual device and the rest of the electronic system, encompassing all technologies between the two. To be able to make well-founded packaging decisions, researchers need to understand a broad range of aspects, including: concepts of transmission bands, antennas and propagation, integrated and discrete package substrates, materials and technologies, interconnects, passive and active components, as well as the advantages and disadvantages of various packages and packaging approaches, and package-level modeling and simulation. Packaging also needs to be considered in terms of system-level testing, as well as associated testing and production costs, and reducing costs. This peer-reviewed work contributes to the extant scholarly literature by addressing the aforementioned concepts and applying them to the context of the millimeter-wave regime and the unique opportunities that this transmission approach offers.

Keywords

Internet of Things Integrated Circuits Millimeter-wave Devices Millimeter-wave Transmission Millimeter-wave Electronics System-on-package System-on-chip Transceivers Microwave Microelectronics Packaging system decision

Authors and affiliations

  • Mladen Božanić
    • 1
  • Saurabh Sinha
    • 2
  1. 1.University of JohannesburgJohannesburgSouth Africa
  2. 2.Faculty of Engineering and the Built EnvironmentUniversity of JohannesburgJohannesburgSouth Africa

Bibliographic information

  • DOI https://doi.org/10.1007/978-3-030-14690-0
  • Copyright Information Springer Nature Switzerland AG 2019
  • Publisher Name Springer, Cham
  • eBook Packages Engineering
  • Print ISBN 978-3-030-14689-4
  • Online ISBN 978-3-030-14690-0
  • Series Print ISSN 2194-8402
  • Series Online ISSN 2194-8410
  • Buy this book on publisher's site