© 2002

Materials & Process Integration for MEMS

  • Francis E. H. Tay

Part of the Microsystems book series (MICT, volume 9)

Table of contents

  1. Front Matter
    Pages N3-xix
  2. Paul Muralt, Nicolas Ledermann, Jacek J. Baborowski, Sandrine Gentil
    Pages 1-24
  3. T. Lalinsky, M. Drzik, L. Matay, I. Kostic, Z. Mozolova, S. Hascik et al.
    Pages 51-75
  4. T. L. Tan, V. A. Kudryashov, B. L. Tan
    Pages 97-111
  5. Francis E. H. Tay, S. J. O’Shea, Andrew T. S. Wee, Poh Chong Lim, Andojo Ongkodjojo
    Pages 113-132
  6. K. N. Bhat, N. DasGupta, A. DasGupta, P. R. S. Rao, R. Navin Kumar, Y. Chandana
    Pages 133-156
  7. J. T. Sheu, H. T. Chou, W. L. Cheng, C. H. Wu, L. S. Yeou
    Pages 157-174
  8. Dong-il Dan Cho, Jongpal Kim, Setae Kim, Sangjun Park, Seung-Joon Paik, Chiwan Ku et al.
    Pages 175-184
  9. Arief Budiman Suriadi, Vineet Sharma, Bernhard Wieder, Gerald Mittendorfer
    Pages 203-229
  10. Dong-il Dan Cho, Sangjun Park, Jongpal Kim, Sangchul Lee, Sang Woo Lee
    Pages 257-272
  11. Won Jong Yoo, Kitt Wai Kok, Say Yong Koh
    Pages 273-294
  12. Back Matter
    Pages 295-299

About this book


The field of materials and process integration for MEMS research has an extensive past as well as a long and promising future. Researchers, academicians and engineers from around the world are increasingly devoting their efforts on the materials and process integration issues and opportunities in MEMS devices. These efforts are crucial to sustain the long-term growth of the MEMS field. The commercial MEMS community is heavily driven by the push for profitable and sustainable products. In the course of establishing high­ volume and low-cost production processes, the critical importance of materials properties, behaviors, reliability, reproducibility, and predictability, as well as process integration of compatible materials systems become apparent. Although standard IC fabrication steps, particularly lithographic techniques, are leveraged heavily in the creation of MEMS devices, additional customized and novel micromachining techniques are needed to develop sophisticated MEMS structures. One of the most common techniques is bulk micromachining, by which micromechanical structures are created by etching into the bulk of the substrates with either anisotropic etching with strong alk:ali solution or deep reactive-ion etching (DRIB). The second common technique is surface micromachining, by which planar microstructures are created by sequential deposition and etching of thin films on the surface of the substrate, followed by a fmal removal of sacrificial layers to release suspended structures. Other techniques include deep lithography and plating to create metal structures with high aspect ratios (LIGA), micro electrodischarge machining (J.


X-ray alloy metals polymer polymers

Editors and affiliations

  • Francis E. H. Tay
    • 1
  1. 1.The National University of SingaporeSingapore

Bibliographic information

  • Book Title Materials & Process Integration for MEMS
  • Editors Francis E. H. Tay
  • Series Title Microsystems
  • DOI
  • Copyright Information Springer-Verlag US 2002
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Hardcover ISBN 978-1-4020-7175-1
  • Softcover ISBN 978-1-4419-5303-2
  • eBook ISBN 978-1-4757-5791-0
  • Series ISSN 1389-2134
  • Edition Number 1
  • Number of Pages XIX, 299
  • Number of Illustrations 0 b/w illustrations, 0 illustrations in colour
  • Topics Characterization and Evaluation of Materials
    Classical Mechanics
  • Buy this book on publisher's site
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