Package Electrical Modeling, Thermal Modeling, and Processing for GaAs Wireless Applications

  • Dean L. Monthei

Part of the Electronic Packaging and Interconnects Series book series (EPAC, volume 2)

Table of contents

  1. Front Matter
    Pages i-xiv
  2. High Frequency Issues

    1. Front Matter
      Pages 1-1
    2. Dean L. Monthei
      Pages 3-28
    3. Dean L. Monthei
      Pages 29-41
  3. Electrical Modeling of Packages

    1. Front Matter
      Pages 43-43
    2. Dean L. Monthei
      Pages 45-61
    3. Dean L. Monthei
      Pages 63-83
    4. Dean L. Monthei
      Pages 85-120
  4. Thermal Modeling

    1. Front Matter
      Pages 121-121
    2. Dean L. Monthei
      Pages 123-131
    3. Dean L. Monthei
      Pages 133-140
    4. Dean L. Monthei
      Pages 141-150
    5. Dean L. Monthei
      Pages 151-153
    6. Dean L. Monthei
      Pages 155-163
    7. Dean L. Monthei
      Pages 165-170
  5. Processing Issues with Packaging GaAs High Frequency Components

    1. Front Matter
      Pages 171-171
    2. Dean L. Monthei
      Pages 173-179
    3. Dean L. Monthei
      Pages 181-190
    4. Dean L. Monthei
      Pages 191-205
    5. Dean L. Monthei
      Pages 206-210
  6. Back Matter
    Pages 211-234

About this book


This book discusses the practical aspects of electrical and thermal modeling of packages. In addition, processing concerns for plastic packaged GaAs parts are also covered. The book emphasizes low cost industry standard packages. However, the principles involved translate well to other categories of packages. Digital issues such as crosstalk are well documented in other books and are therefore not covered in detail in this text. The principles for generation of equivalent circuit package models applies to both digital and analog parts. Digital designers and packaging engineers should still find this text useful. Subtleties often overlooked by standard methods of modeling packages for digital applications are considered and will become more important to the digital packaging engineer as frequencies continue to increase. It is hoped this book will be useful to both microwave and digital integrated circuit (Ie) designers as well as packaging engineers. In the past these disciplines were distinct. Packaging engineers typically were concerned with only materials and mechanical issues of the package. As long as there was an electrical connection made from the die to the external pin, packaging engineers had the freedom to do anything they wanted between these two points. At high frequency the issues change. Packaging engineers now have to work with die level designers to either create a package that performs well at high frequencies or to use readily available low cost packages that happen to meet the needs of the application.


analog circuit design dielectric properties finite element method frequency integrated circuit material measurement microwave model modeling production software Standard

Authors and affiliations

  • Dean L. Monthei
    • 1
  1. 1.TriQuint SemiconductorUSA

Bibliographic information

  • DOI
  • Copyright Information Kluwer Academic Publishers 1999
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Print ISBN 978-0-7923-8364-2
  • Online ISBN 978-1-4615-5111-9
  • Series Print ISSN 1389-2169
  • Buy this book on publisher's site
Industry Sectors
Energy, Utilities & Environment