© 1992

Fine Pitch Surface Mount Technology

Quality, Design, and Manufacturing Techniques


Table of contents

  1. Front Matter
    Pages i-xi
  2. Phil P. Marcoux
    Pages 1-28
  3. Phil P. Marcoux
    Pages 29-67
  4. Phil P. Marcoux
    Pages 68-75
  5. Phil P. Marcoux
    Pages 107-148
  6. Phil P. Marcoux
    Pages 149-168
  7. Phil P. Marcoux
    Pages 169-199
  8. Phil P. Marcoux
    Pages 200-205
  9. Phil P. Marcoux
    Pages 206-217
  10. Phil P. Marcoux
    Pages 218-240
  11. Phil P. Marcoux
    Pages 241-264
  12. Phil P. Marcoux
    Pages 265-283
  13. Phil P. Marcoux
    Pages 284-318
  14. Back Matter
    Pages 319-340

About this book


Fine pitch high lead count integrated circuit packages represent a dramatic change from the conventional methods of assembling electronic components to a printed interconnect circuit board. To some, these FPTpackages appear to bean extension of the assembly technology called surface mount or SMT. Many of us who have spent a significant amount of time developing the process and design techniques for these fine pitchpackages haveconcluded that these techniquesgobeyondthose commonly useed for SMT. In 1987 the presentauthor, convincedofthe uniqueness ofthe assembly and design demands ofthese packages, chaired ajoint committee where the members agreed to use fine pitch technology (FPT) as the defining term for these demands. The committee was unique in several ways, one being that it was the first time three U. S. standards organizations, the IPC (Lincolnwood, IL), theEIA(Washington, D. C. ),and theASTM (Philadelphia),cametogether tocreate standards before a technology was in high demand. The term fine pitch technology and its acronym FPT have since become widely accepted in the electronics industry. The knowledge of the terms and demands of FPT currently exceed the usage of FPT packaged components, but this is changing rapidly because of the size, performance, and cost savings of FPT. I have resisted several past invitations to write other technical texts. However, I feel there are important advantages and significant difficulties to be encountered with FPT.


assembly circuit Counter design electronics integrated circuit interconnect manufacturing performance reliability stability Standard Standards

Authors and affiliations

  1. 1.PPM Associates, Inc.SunnyvaleUSA

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