Physical Design for Multichip Modules

  • M. Sriram
  • S. M. Kang

Table of contents

  1. Front Matter
    Pages i-xv
  2. M. Sriram, S. M. Kang
    Pages 1-23
  3. M. Sriram, S. M. Kang
    Pages 25-68
  4. M. Sriram, S. M. Kang
    Pages 69-97
  5. M. Sriram, S. M. Kang
    Pages 99-120
  6. M. Sriram, S. M. Kang
    Pages 121-145
  7. M. Sriram, S. M. Kang
    Pages 147-174
  8. M. Sriram, S. M. Kang
    Pages 175-179
  9. Back Matter
    Pages 181-197

About this book


Physical Design for Multichip Modules collects together a large body of important research work that has been conducted in recent years in the area of Multichip Module (MCM) design. The material consists of a survey of published results as well as original work by the authors. All major aspects of MCM physical design are discussed, including interconnect analysis and modeling, system partitioning and placement, and multilayer routing. For readers unfamiliar with MCMs, this book presents an overview of the different MCM technologies available today. An in-depth discussion of various recent approaches to interconnect analysis are also presented. Remaining chapters discuss the problems of partitioning, placement, and multilayer routing, with an emphasis on timing performance. For the first time, data from a wide range of sources is integrated to present a clear picture of a new, challenging and very important research area. For students and researchers looking for interesting research topics, open problems and suggestions for further research are clearly stated.
Points of interest include :
  • Clear overview of MCM technology and its relationship to physical design;
  • Emphasis on performance-driven design, with a chapter devoted to recent techniques for rapid performance analysis and modeling of MCM interconnects;
  • Different approaches to multilayer MCM routing collected together and compared for the first time;
  • Explanation of algorithms is not overly mathematical, yet is detailed enough to give readers a clear understanding of the approach;
  • Quantitative data provided wherever possible for comparison of different approaches;
  • A comprehensive list of references to recent literature on MCMs provided.


algorithms construction interconnect material modeling

Authors and affiliations

  • M. Sriram
    • 1
  • S. M. Kang
    • 2
  1. 1.Beckman Institute for Advanced Science & TechnologyUniversity of IllinoisUrbana-ChampaignUSA
  2. 2.Coordinated Science LaboratoryUniversity of IllinoisUrbana-ChampaignUSA

Bibliographic information

  • DOI
  • Copyright Information Kluwer Academic Publishers 1994
  • Publisher Name Springer, Boston, MA
  • eBook Packages Springer Book Archive
  • Print ISBN 978-1-4613-6153-4
  • Online ISBN 978-1-4615-2682-7
  • Series Print ISSN 0893-3405
  • Buy this book on publisher's site
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