© 2008

Micro-Assembly Technologies and Applications

IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS’2008) Chamonix, France February 10–13, 2008

  • Svetan Ratchev
  • Sandra Koelemeijer


  • The papers in this volume were peer-reviewed and carefully selected

  • Much information in this series is published in advance of journal publication

  • The contributors in this volume are world-renowned experts in their field

Conference proceedings IPAS 2008

Part of the IFIP — International Federation for Information Processing book series (IFIPAICT, volume 260)

Table of contents

  1. Front Matter
    Pages i-xiii
  2. Design of Micro Products

    1. Front Matter
      Pages 1-1
    2. Methods of Design for Micro-Assembly

      1. Carsten Tietje, Richard Leach, Michele Turitto, Ronaldo Ronaldo, Svetan Ratchev
        Pages 5-12
      2. Marcel Tichem, Dafina Tanase
        Pages 13-22
      3. Pierre-Antoine Adragna, Hugues Favrelière, Serge Samper, Maurice Pillet
        Pages 23-33
    3. Methods and Solutions for Micro-Product Design

      1. Amar Kumar Behera, Shiv G. Kapoor, Richard E. DeVor
        Pages 37-53
      2. Ludovic Charvier, Fabien Bourgeois, Jacques Jacot, Grégoire Genolet, Hubert Lorenz
        Pages 67-74
      3. O. Smal, B. Raucent, F. Ceyssens, R. Puers, M. De Volder, D. Reynaerts
        Pages 75-86
      4. Ingo Sieber, Ulrich Gengenbach, Rudolf Scharnowell
        Pages 87-93
  3. Micro-Assembly Processes and Applications

    1. Front Matter
      Pages 95-95
    2. Process Modelling for Micro-Assembly

    3. High Precision Packaging and Assembly Processes

      1. Markus Luetzelschwab, Dominik Weiland, Marc P. Y. Desmulliez
        Pages 129-138
      2. Erik Beckert, Thomas Burkhardt, Ramona Eberhardt, Andreas Tünnermann
        Pages 139-147
      3. N. Boufercha, J. Sägebarth, M. Burgard, N. Othman, D. Schlenker, W. Schäfer et al.
        Pages 149-159
      4. Sven Rathmann, Annika Raatz, Jürgen Hesselbach
        Pages 161-169
      5. Hongyi Yang, Gregory Tsiklos, Ronaldo Ronaldo, Svetan Ratchev
        Pages 171-176
      6. Ronaldo Ronaldo, Thomas Papastathis, Hongyi Yang, Carsten Tietje, Michele Turitto, Svetan Ratchev
        Pages 177-185

About these proceedings


International Federation for Information Processing

The IFIP series publishes state-of-the-art results in the sciences and technologies of information and communication. The scope of the series includes: foundations of computer science; software theory and practice; education; computer applications in technology; communication systems; systems modeling and optimization; information systems; computers and society; computer systems technology; security and protection in information processing systems; artificial intelligence; and human-computer interaction. Proceedings and post-proceedings of referred international conferences in computer science and interdisciplinary fields are featured. These results often precede journal publication and represent the most current research. The principal aim of the IFIP series is to encourage education and the dissemination and exchange of information about all aspects of computing.

For more information about the 300 other books in the IFIP series, please visit


artificial intelligence communication human-computer interaction (HCI) information system integrated circuit intelligence metal-oxide-semiconductor transistor optimization system modeling

Editors and affiliations

  • Svetan Ratchev
    • 1
  • Sandra Koelemeijer
    • 2
  1. 1.University of NottinghamUK
  2. 2.École Polytechnique Fédérale de LausanneSwitzerland

Bibliographic information

  • Book Title Micro-Assembly Technologies and Applications
  • Book Subtitle IFIP TC5 WG5.5 Fourth International Precision Assembly Seminar (IPAS’2008) Chamonix, France February 10–13, 2008
  • Editors Svetan Ratchev
  • Series Title IFIP — International Federation for Information Processing
  • DOI
  • Copyright Information International Federation for Information Processing 2008
  • Publisher Name Springer, Boston, MA
  • eBook Packages Computer Science Computer Science (R0)
  • Hardcover ISBN 978-0-387-77402-2
  • Softcover ISBN 978-1-4419-4591-4
  • eBook ISBN 978-0-387-77405-3
  • Series ISSN 1571-5736
  • Edition Number 1
  • Number of Pages XIII, 416
  • Number of Illustrations 0 b/w illustrations, 0 illustrations in colour
  • Topics Circuits and Systems
    Artificial Intelligence
    Information Systems Applications (incl. Internet)
  • Buy this book on publisher's site
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