Abstract
In this study, we developed effective carbon-rich Al2O3 interlayers for flexible moisture barrier films. The carbon-rich Al2O3 films were deposited with excessive supply of trimethylaluminum (TMA) precursor. The five-layer structure was made with alternate layers of low-carbon Al2O3 and carbon-rich Al2O3 and the water vapor transmission rate (WVTR) of 3.3 × 10 −4 g/(m2·day) was demonstrated. The WVTR of the multilayer films is reduced by 36% compared to 25 nm thick single Al2O3 barrier film. The WVTR of the five-layer film shows increase of 86% after 1,000 bending at a 1.5 cm radius, while single Al2O3 thin films increased by 367%.
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References
S. Logothetidis, Mat. Sci. Eng. B 152, 96, (2008).
J. S. Lewis and M. S. Weaver, J. Quantum. Electron. 10, 45 (2004).
J. S. Park, H. Chae, H. K. Chung and S. I. Lee, Semicond. Sci. Technol. 26, 034001, (2011).
M. D. Groner, F. H. Fabreguette, J. W. Elam and S. M. George, Chem. Mater. 16, 639, (2004).
Y. Q. Yang, Y. Duan, P. Chen, F. B. Sun, Y. H. Duan, X. Wang and D. Yang, J. Phys. Chem. C 117, 20308 (2013).
Y. Duan, F. Sun, Y. Yang, P. Chen, D. Yang, Y. Duan and X. Wang, Appl. Mater. Interfaces 6, 3799 (2014).
P. F. Carcia, R. S. McLean, M. H. Reilly, M. D. Groner and S. M. George, ACS Appl. Phys. Lett. 89, 031915 (2006).
A. A. Dameron, S. D. Davidson, B. B. Burton, P. F. Carcia, R. S. McLean and S. M. George, J. Phys. Chem. 112, 4573 (2008).
S. Franke, M. Baumkötter, C. Monka, S. Raabe, R. Caspary, H. H. Johannes, W. K. Beck and A. P. Gargouri, J. Vac. Sci. Technol. A 35, 01B117-1 (2017).
P. Poodt, D. C. Cameron, E. Dickey, S. M. George, V. Kuznetsov, G. N. Parsons, F. Roozeboom, G. Sundaram and A. Vermeer, J. Vac. Sci. Technol. A 30, 010802 (2012).
T. Hirvikorpi, R. Laine, M. Vaha-Nissi, V. Kilpi, E. Salo, W. M. Li, S. Lindfors, J. Vartiainen, E. Kentta, J. Nikkola, A. Harlin and J. Kostamo, Thin Solid Films 550, 164 (2014).
P. S. Maydannik, A. Plyushch, M. Sillanpaa and D. C. Cameron, J. Vac. Sci. Technol. A 33, 031603 (2015).
K. Sharma, R. A. Hall and S. M. George, J. Vac. Sci. Technol. A 33, 01A132 (2015).
S. A. Starostin, W. Keuning, J. P. Schalken, M. Creatore, W. M. M. Kessels, J. B. Bouwstra, M. C. M. van de Sanden and H. W. de Vries, Plasma. Process. Polym. 13, 311 (2016).
L. Hoffmann, D. Theirich, S. Pack, F. Kocak, D. Schlamm, T. Hasselmann, H. Fahl, A. Räupke, H. Gargouri and T. Riedl, ACS Appl. Mater. Interfaces 9, 4171 (2017).
L. Hoffmann, D. Theirich, D. Schlamm, T. Hasselmann, S. Pack, K. O. Brinkmann, D. Rogalla, S. Peters, A. Räupke, H. Gargouri and T. Riedl, J. Vac. Sci. Technol. A 36, 01A112 (2018).
S. W. Seo, E. Jung, C. Lim, H. Chae and S. M. Cho, Thin Solid Films 520, 6690 (2012).
S. W. Seo, H. K. Chung, H. Chae, S. J. Seo and S. M. Cho, NANO 8, 1350041 (2013).
S. Park, W. M. Yun, L. H. Kim, S. Park, S. H. Kim and C. E. Park, Org. Electron. 14, 3385 (2013).
Z. Chen, H. Wang, X. Wang, P. Chen, Y. Liu, H. Zhao, Y. Zhao and Y. Duan, SCI. REP. 7, 40061 (2017).
H. Jang, H. Ding, M. Wei, C. Li, B. Wei and J. H. Zhang, Nanoscale. Res. Lett. 10, 1186 (2015).
Y. G. Lee, Y. H. Choi, I. S. Kee, H. S. Shim, Y. W. Jin, S. Lee, K. H. Koh and S. Lee, Org. Electron. 10, 1352 (2009).
B. J. Kim, H. Park, H. Seong, M. S. Lee, B. H. Kwon, D. H. Kim, Y. I. Lee, H. Lee, J. I. Lee and S. G. Im, Adv. Eng. Mater. 10, 1600819 (2017).
E. G. Jeong, Y. C. Han, H. G. Im, B. S. Bae and K. C. Choi, Org. Electron. 33, 150 (2016).
H. Zhange, H. Ding, M. Wei, C. Li, B. Wei and J. Zhang, Nanoscale. Res. Lett. 10, 169 (2015).
W. Xiao, D. Y. Hui, C. Zheng, D. Yu, Y. Y. Qiang, C. Ping, C. L. Xiang and Z. Yi, Nanosacle. Res. Lett. 10, 130 (2015).
D. Yu, Y. Q. Yang, Z. Chen, Y. Tao and Y. F. Liu, Opt. Commun. 43, 362 (2016).
S. W. Seo, E. Jung, H. Chae and S. M. Cho, Org. Electon. 13, 2436 (2012).
K. Djebaili, Z. Mekhalif, A. Boumaza and A. Djelloull, J. Spectro. 16, 868109 (2015).
I. Iatsunskyi, M. Kempinski, M. Jancelewicz, K. Zaleski, S. Jurga and V. Smyntyna, Vacuum 113, 52 (2015).
E. Raymundo-Pi˜nero, D. Cazorla-Amorós, A. Linares-Solano, J. Find, U. Wild and R. Schlögl, Carbon 40, 597 (2002).
S. Kundu, Y. Wang, W. Xia and M. Muhler, J. Phys. Chem. C 112, 16869 (2008).
M. Li, D. Gao, S. Li, Z. Zhou, J. Zou, H. Tao, L. Wang, M. Xu and J. Peng, RCS adv. 5, 104613 (2015).
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Yong, S.H., Kim, S.J., Park, J.S. et al. Flexible Carbon-rich Al2O3 Interlayers for Moisture Barrier Films by a Spatially-Resolved Atomic Layer Deposition Process. J. Korean Phys. Soc. 73, 40–44 (2018). https://doi.org/10.3938/jkps.73.40
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DOI: https://doi.org/10.3938/jkps.73.40