We conducted computational fluid dynamic (CFD) simulations to improve the thickness uniformity of cluster-sputtered porous metal films. The cluster sputtering equipment was divided into a module where the sputtered metal atoms condensed and cluster nanoparticles formed and a chamber where porous metal films were deposited. To optimize the equipment geometry, we performed simulations and deposition experiments for various planar nozzle positions and nozzle-to-substrate distances in the module. The simulated gas velocity distribution 25 mm above the substrate exhibited a similar tendency to the thickness distribution of the deposited porous Cu films. When a 4-mm nozzle was located 40 and 240 mm from the module center and substrate, respectively, the simulated gas velocity distribution exhibited uniformity to within 8.4% for the substrate with a 70-mm radius. The thickness uniformity and the deposition rate of the deposited porous Cu films were 9.3% and 2 µm/min, respectively, using equipment with the same geometry.
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This work was supported by the Industrial Technology Innovation Program (No. 10077465) funded by the Ministry of Trade, Industry, and Energy (MOTIE) and by the Priority Research Center Program (NRF-2017 R1A6A1A03015562) funded by the Ministry of Education (MOE) of the Republic of Korea.
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Kim, J.H., Park, S.Y., Lee, H.C. et al. A Study on Computational Fluid Dynamic Simulations to Improve the Thickness Uniformity of Porous Metal Films Deposited by Using Cluster Sputtering. J. Korean Phys. Soc. 76, 27–33 (2020). https://doi.org/10.3938/jkps.76.27
- Porous metal films
- Cluster sputtering
- Thickness uniformity