Journal of Zhejiang University-SCIENCE A

, Volume 19, Issue 5, pp 399–408 | Cite as

Influence of annealing conditions on the properties of Cu(In,Ga)Se2 thin films fabricated by electrodeposition

  • Jing-yu Qu
  • Zheng-fei Guo
  • Kun Pan
  • Wei-wei Zhang
  • Xue-jin Wang


Cu(In,Ga)Se2 (CIGS) precursor films were deposited on Mo/glass by electrodeposition, and then annealed in Se vapor. The annealing temperature ranged from 450 °C to 580 °C, and two heating rates were selected. The results showed that the crystalline quality of the CIGS films and formation of the Cu-Se compound could be strongly influenced by the selenization temperature and heating rate. Raman spectroscopy and X-ray diffraction (XRD) analysis showed that when the selenization temperature was increased from 450 °C to 550 °C, the amount of binary CuSe phase decreased and the amount of Cu2Se increased. After annealing at 580 °C, a minimum amount of Cu2−xSe compounds was obtained and the degree of CIGS film crystallinity was higher than in other samples. The relationship between the properties of the film and the heating rate was studied. XRD and Raman spectra showed a decrease in the Cu2−xSe phase with increasing heating rate. Scanning electron microscopy (SEM) and XRD showed a remarkable increase in the grain size of CIGS during rapid heating.

Key words

Cu(In,Ga)Se2 (CIGS) thin films Electrodeposition Selenization Raman spectroscopy 








1. 在水溶液中利用电沉积法制备出铜铟镓硒薄膜前驱体。2. 对前驱体进行退火处理,并针对不同的样品采用不同的退火温度和升温速率。3. 利用X 射线衍射(XRD)、拉曼光谱(Raman)、扫描电子显微镜(SEM)、X 射线荧光光谱(XRF)对薄膜进行表征,分析不同退火条件对结果的影响规律。


1. 退火温度的影响:退火温度由450 °C 升高到580 °C 时,得到的薄膜结晶性越来越好,晶粒边界越来越不明显,Cu/(In+Ga)的比例逐渐升高,说明高温下(≥450 °C)金属铟和镓较易挥发;实验中还发现Cu-Se 化合物的总含量随退火温度的升高而降低。2. 升温速率的影响:退火速率越高,薄膜结晶性越好;快速升温时薄膜中Cu/(In+Ga)的比例略低于慢速升温时的样品,而Ga/(In+Ga)的比例几乎不变,说明快速升温可以减少In 和Ga 的挥发。


铜铟镓硒薄膜 电沉积 退火条件 拉曼光谱 

CLC number

O47 O64 


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The authors thank Prof. Leo WM LAU and Dr. Cheng LIAO (Chengdu Green Energy and Green Manufacturing Technology R&D Centre, Chengdu Development Center of Science and Technology, China) for their technical and experimental supports, and thank China Academy of Engineering Physics for suggestion about the study.


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Copyright information

© Zhejiang University and Springer-Verlag GmbH Germany, part of Springer Nature 2018

Authors and Affiliations

  1. 1.College of ScienceChina Agricultural UniversityBeijingChina

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