Journal of Zhejiang University-SCIENCE A

, Volume 7, Issue 3, pp 472–476 | Cite as

Characterization of DC magnetron sputtering deposited thin films of TiN for SBN/MgO/TiN/Si structural waveguide

  • Xu Xuan-qian  (徐玄前)
  • Ye Hui  (叶辉)
  • Zou Tong  (邹桐)
Article

Abstract

Optimal parameters for depositing Titanium nitride (TiN) thin films by DC reactive magnetron sputtering were determined. TiN thin films were deposited on Si (100) substrates by DC reactive magnetron sputtering, at different temperatures, different electrical current values, and different N2/Ar ratios. Structural characteristics of TiN thin films were measured by X-ray diffraction (XRD); surface morphology of the thin films was characterized using an atomic force microscope (AFM). The electric resistivity of the TiN films was measured by a four-point probe. In the result, temperature is 500 °C, electrical current value is 1.6 A, pure N2 is the reacting gas, TiN thin film has the preferred (200) orientation, resistance is small enough for its use as bottom electrodes.

Key words

Titanium nitride (TiN) Thin film Sputtering Orientation Waveguide 

Preview

Unable to display preview. Download preview PDF.

Unable to display preview. Download preview PDF.

References

  1. Arnell, R.D., Colligon, J.S., Minnebaev, K.F., Yurasova, V.E., 1996. The effect of nitrogen content on the structure and mechanical properties of TiN.films produced by magnetron sputtering. Vacuum, 47(5):425–431. [doi:10.1016/0042-207X(95)00241-3]CrossRefGoogle Scholar
  2. Banerjee, R., Chandra, R., Ayyub, P., 2002. Influence of the sputtering gas on the preferred orientation of nanocrystalline titanium nitride thin films. Thin Solid Films, 405(1–2):64–72. [doi:10.1016/S0040-6090(01)01705-9]CrossRefGoogle Scholar
  3. Chen, Y.M., Yu, G.P., Huang, J.H., 2001. Role of process parameters in the texture evolution of TiN films deposited by hollow cathode discharge ion platingtechnol. Surf. Coat. Technol., 141(2–3):156–163. [doi:10.1016/S0257-8972(01)01201-4]CrossRefGoogle Scholar
  4. Chou, W.J., Yu, G.P., Huang, J.H., 2001. Deposition of TiN thin film on Si (100) by HCD ion plating. Surf. Coat. Technol., 140(3):206–214. [doi:10.1016/S0257-8972(01)01120-3]CrossRefGoogle Scholar
  5. Cuniot-Ponsard, M., Desvignes, J.M., Ea-Kim, B., 2003. Radio frequency magnetron sputtering deposition of hetero-epitaxial strontium barium niobate thin films (SrxBa1-xNb2O6). J. Appl. Phys., 93(3):1718–1724. [doi:10.1063/1.1535749]CrossRefGoogle Scholar
  6. Groudeva-Zotova, S., Kaltofen, R., Sebald, T., 2000. DC reactive magnetron sputter deposition of (111) textured TiN films: influence of nitrogen flow and discharge power on the texture formation. Surf. Coat. Technol., 127(2–3):144–154. [doi:10.1016/S0257-8972(00)00569-7]CrossRefGoogle Scholar
  7. Huang, J.H., Tsai, Y.P., Yu, G.P., 1999. Effect of processing parameters on the microstructure and mechanical properties of TiN film on stainless steel by HCD ion plating. Thin Solid Films, 355–356(1):440–445. [doi:10.1016/S0040-6090(99)00670-7]CrossRefGoogle Scholar
  8. Huang, J.H., Lin, C.H., Ma, C.H., Chen, H., 2000. Low energy ion beam assisted deposition of TiN thin films on silicon. Scripta. Mater., 42(6):573–579. [doi:10.1016/S1359-6462(99)00393-0]CrossRefGoogle Scholar
  9. Hultman, L., Sundgren, J.E., Greene, J.E., Bergstrom, D.B., Petrov, I., 1995. High-flux low-energy (20 eV) N+ 2 ion irradiation during TiN deposition by UHV reactive magnetron sputtering: Effects on microstructure and preferred orientation. J. Appl. Phys., 78(9):5395–5403. [doi:10.1063/1.359720]CrossRefGoogle Scholar
  10. Kelly, P.J., Armell, R.D., 2000. Magnetron sputtering: A review of recent developments and applications. Vacuum, 56(3):159–172. [doi:10.1016/S0042-207X(99)00189-X]CrossRefGoogle Scholar
  11. Koch, A., Raven, C., Spanne, P., Snigirev, A., 1998. X-ray imaging with submicrometer resolution employing transparent luminescent screens. Journal of the Optical Society of America A, 15(7):1940–1951.CrossRefGoogle Scholar
  12. Li, T.Q., Noda, S., Tsuji, Y., Ohsawa, T., Komiyama, H., 2002. Initial growth and texture formation during reactive magnetron. Sputtering of TiN on Si (111). J. Vac. Sci. Technol., 20(3):583–588. [doi:10.1116/1.1458944]CrossRefGoogle Scholar
  13. Murray, J.L., 1987. Phase Diagrams of Binary Titanium Alloys. ASM International, Ohio, p.176.Google Scholar
  14. Sundgren, J.E., 1985. Structure and properties of TiN coatings. Thin Solid Films, 128(1–2):21–44. [doi:10.1016/0040-6090(85)90333-5]CrossRefGoogle Scholar

Copyright information

© Springer-Verlag 2006

Authors and Affiliations

  • Xu Xuan-qian  (徐玄前)
    • 1
  • Ye Hui  (叶辉)
    • 1
  • Zou Tong  (邹桐)
    • 1
  1. 1.State Key Laboratory of Modern Optical InstrumentationZhejiang UniversityHangzhouChina

Personalised recommendations