Abstract
MEMS community is increasingly using SU-8 as a structural material because it is self-patternable, compliant and needs a low thermal budget. While the exposed layers act as the structural layers, the unexposed SU-8 layers can act as the sacrificial layers, thus making it similar to a surface micromachining process. A sequence of exposed and unexposed SU-8 layers should lead to the development of a SU-8 based MEMS chip integrated with a pre-processed CMOS wafer. A process consisting of optical lithography to obtain SU-8 structures on a CMOS wafer is described in this paper.
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References
- 1.
Vora K D, Shew B Y, Harvey E C, Hayes J P and Peele A G J. Micromech. Microeng. 15, 978 (2005).
- 2.
Jiang K, Lancaster M J, Llamas-Garro I and Jin P J. Micromech. Microeng. 15, 1522 (2005)
- 3.
Williams J D and Wang W Microsyst.Technol. 10, 694 (2004)
- 4.
Zhang J, Chan-Park M B and Conner S R Lab on a Chip 4 646 (2004)
- 5.
Chang H-K and Kim Y-K Sensors Actuators A 84, 342 (2000)
- 6.
L. Gammelgaard,P. A. Rasmussen, M. Calleja, P. Vettiger, and A. Boisen Appl. Phy. Lett 88, 113508(2006)
- 7.
Seena V, Anukool Rajorya, Prita Pant, S Mukherji, V Ramgopal Rao Solid State Science, 11, 1606 (2009)
- 8.
Prashant Mali, Aniruddh Sarkar, Rakesh Lal, Lab on Chip 6 310(2006)
- 9.
Ceyssens F, Puers R J Micromech. Microeng. 16(6) 19(2006)
- 10.
Seidemann V, Rabe J, Feldmann M and Buttgenbach S Microsyst. Technol. 8 348(2002)
- 11.
Bertsch A, Lorenz H and Renaud P Sensors Actuators A 73 14(1999)
- 12.
Chuang Y-J, Tseng F-G, Cheng J-H and LinW-K Sensors Actuators A 103 64(2003)
- 13.
F. H. Tay, J. A. Kan, F. Watt, W. O. Choong J. Micromech. Microeng. 11(1) 27 (2000).
- 14.
I G Foulds and M Parameswaran J. Micromech. Microeng. 16, 2109 (2006)
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Ray, P., Seena, V., Apte, P.R. et al. High Yield Polymer MEMS Process for CMOS/MEMS Integration. MRS Online Proceedings Library 1299, 412 (2011). https://doi.org/10.1557/opl.2011.58
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