Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in Microelectronics

Abstract

In this paper, silver nanoparticles with a mean diameter of 40 nm are studied for future applications in microelectronic devices. The enhanced diffusivity of nanoparticles is exploited to fabricate electrical interconnects at low temperature. Sintering condition has been tuned to tailor the grain size so that electrical resistivity can be lowered down to 3.4 μOhm∙cm. In this study, a {111}-textured gold thin film has been used to increase diffusion routes. The combined effects of the substrate crystalline orientation and the sintering condition have been demonstrated to have a significant impact on microstructures. In particular, a {111} fiber texture is developed above 300°C in printed silver only if the underlying film exhibits a preferential orientation. This condition appeared as essential for the efficiency of the gold wire-bonding process step. Thus, inkjet-printed interconnects show a prospective potential compared to conventional subtractive technique and offers new opportunities for low cost metallization in electronics packaging.

This is a preview of subscription content, access via your institution.

References

  1. 1.

    D. Kim and J. Moon, Electrochem. Solid-State Lett. 8, J30 (2005).

    Article  Google Scholar 

  2. 2.

    P. Buffat and J.-P. Borel, Phys. Rev. A 13, 2287 (1976).

    CAS  Article  Google Scholar 

  3. 3.

    Q. Jiang and F. G. Shi, Journal of Material Science and Technology 14, 171 (1998).

    CAS  Google Scholar 

  4. 4.

    M. A. Asoro, D. Kovar, Y. Shao-Horn, L. F. Allard, and P. J. Ferreira, Nanotechnology 21, 025701 (2010).

    CAS  Article  Google Scholar 

  5. 5.

    C. L. Chang, Y. C. Chuang, and C. Y. Liu, Electr. Solid-State Lett. 10, H344 (2007).

    Article  Google Scholar 

  6. 6.

    T.-H. Kao, J.-M. Song, I.-G. Chen, T.-Y. Dong, and W.-S. Hwang, Nanotechnology 18, 435708 (2007).

    Article  Google Scholar 

  7. 7.

    A. F. Mayadas and M. Shatzkes, Phys. Rev. B 1, 1382 (1970).

    Article  Google Scholar 

  8. 8.

    R. Cauchois, M. Saadaoui, J. Legeleux, T. Malia, B. Dubois-Bonvalot, K. Inal, and J.-C. Fidalgo, 3rd IEEE Electronic System-Integration Technology Conference, AP–4 (2010).

  9. 9.

    C. V. Thompson and R. Carel, Materials Science and Engineering B 32, 211 (1995).

    CAS  Article  Google Scholar 

  10. 10.

    Q. Jiang, S. Zhang, and J. Li, Solid State Communications 130, 581 (2004).

    CAS  Article  Google Scholar 

Download references

Author information

Affiliations

Authors

Corresponding author

Correspondence to Romain Cauchois.

Rights and permissions

Reprints and Permissions

About this article

Cite this article

Cauchois, R., Saadaoui, M., Inal, K. et al. Tailoring the Crystallographic Texture and Electrical Properties of Inkjet-printed Interconnects for Use in Microelectronics. MRS Online Proceedings Library 1335, 809 (2011). https://doi.org/10.1557/opl.2011.1264

Download citation