Mechanical annealing of Cu-Si nanowires during high-cycle fatigue

Abstract

Monotonic and cyclic tension-tension tests with an upper stress in the GPa regime have been performed on Cu-Si nanowires. The results show that the exceptional high strength of these nanomaterials is maintained or even improved upon cyclic loading. Post-mortem transmission electron microscopy gives insight in the microstructural evolution. Fatigue-induced grain growth correlates with an observed increase in compliance, the formation of dislocation networks, and an increase in tensile strength.

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Acknowledgments

The authors thank Wenting Huang and Gunther Richter (Max Planck Institute for Intelligent Systems, Stuttgart, Germany) for preparation of the nanowires. This work has been supported by the Robert Bosch Foundation which is gratefully acknowledged. Furthermore, the work was supported by the Project Based Personnel Exchange Program between the China Scholarship Council (CSC) and the German Academic Exchange Service (DAAD).

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Correspondence to Reinhard Schneider.

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For supplementary material for this article, please visit http://dx.doi.org/10.1557/mrc.2014.18

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Ensslen, C., Kraft, O., Monig, R. et al. Mechanical annealing of Cu-Si nanowires during high-cycle fatigue. MRS Communications 4, 83–87 (2014). https://doi.org/10.1557/mrc.2014.18

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