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Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications

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Abstract

Integration of photonic devices on silicon (Si) substrates is a key method in enabling large scale manufacturing of Si-based photonic-electronic circuits for next generation systems with high performance, small form factor, low power consumption, and low cost. Germanium (Ge) is a promising material due to its pseudo-direct bandgap and its compatibility with Si-CMOS processing. In this article, we present our recent progress on achieving high quality germanium-on-silicon (Ge/Si) materials. Subsequently, the performance of various functional devices such as photodetectors, lasers, waveguides, and sensors that are fabricated on the Ge/Si platform are discussed. Some possible future works such as the incorporation of tin (Sn) into Ge will be proposed. Finally, some applications based on a fully monolithic integrated photonic-electronic chip on an Si platform will be highlighted at the end of this article.

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ACKNOWLEDGMENTS

This research was supported by the National Research Foundation Singapore through the Singapore MIT Alliance for Research and Technology’s Low Energy Electronic Systems (LEES) IRG and NRF-CRP12-2013-04. The work was also partially supported by Innovation Grant from SMART Innovation Center. Authors are grateful to the support and resources from the Silicon Technologies Center of Excellence (Si-COE). C.S. Tan is affiliated with NOVITAS (Nanoelectronics Center of Excellence) at NTU. S. Bao is supported by SMA3 Fellowship. We would like to thank Daeik Kim, Chibuzo Onwuka and Donguk Nam from Inha University for their measurement data and valuable discussion. In addition, we are thankful for the support received from the silicon photonics group, Optoelectronics Research Center at the University of Southampton.

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Authors and Affiliations

  1. Low Energy Electronic Systems (LEES), Singapore-MIT Alliance for Research and Technology (SMART), Singapore, 138602, Singapore

    Kwang Hong Lee, Shuyu Bao, Yiding Lin, Yue Wang, Jurgen Michel, Eugene A. Fitzgerald & Chuan Seng Tan

  2. School of Electrical and Electronic Engineering, Nanyang Technological University, Singapore, 639798, Singapore

    Shuyu Bao, Yiding Lin, Wei Li, P. Anantha, Lin Zhang & Chuan Seng Tan

  3. Department of Materials Science and Engineering, Massachusetts Institute of Technology, Cambridge, Massachusetts, 02139, USA

    Jurgen Michel & Eugene A. Fitzgerald

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Lee, K.H., Bao, S., Lin, Y. et al. Hetero-epitaxy of high quality germanium film on silicon substrate for optoelectronic integrated circuit applications. Journal of Materials Research 32, 4025–4040 (2017). https://doi.org/10.1557/jmr.2017.324

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