The tin–bismuth eutectic alloy possesses anomalous physicochemical properties that are dependent on temperature. This paper reports the interfacial reaction and growth behavior of the intermetallic compound (IMC) layer during the dissolution of solid copper in liquid eutectic tin–bismuth at 673–823 K under the influence of the structural transition of liquid eutectic tin–bismuth. The structural transition markedly affected the dissolution rate constant of solid copper and the growth rate of the IMCs. Correspondingly, the application of the liquid structural transition significantly decreased the activation energy of dissolution and increased the apparent activation energy for IMC growth. Moreover, two major roles of elemental Bi on the formation and growth of the IMCs were suggested.
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This work is financially supported by the National Natural Science Foundation of China (Grant Nos 51101067 and 51301073) and the Natural Science Foundation of the Higher Education Institutions of Anhui Province (Grant No. KJ2015A098).
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Ding, GH., Qi, X., Liu, SL. et al. Effect of liquid structural transition on the dissolution of solid copper in liquid eutectic tin–bismuth. Journal of Materials Research 31, 1145–1152 (2016). https://doi.org/10.1557/jmr.2016.118