Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation–CORRIGENDUM

doi: 10.1557/jmr.2012.430, Published by Cambridge University Press, 17 January 2013.

In Sarobol et al.,1 Fig. 1 is missing the following permission line:

© 2013 IEEE. Reprinted, with permission, from P. Sarobol, A.E. Pedigo, P. Su, J.E. Blendell, and C.A. Handwerker: Defect morphology and texture in Sn, Sn–Cu, and Sn–Cu–Pb electroplated films. IEEE Trans. Electron. Packag. Manuf. 33, 159–164 (2010).

The authors regret the mistake.

REFERENCE

  1. 1.

    Pylin Sarobol, Wei-Hsun Chen, Aaron E. Pedigo, Peng Su, John E. Blendell, and Carol A. Handwerker: Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation. J. Mater. Res. (2013).

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Sarobol, P., Chen, WH., Pedigo, A.E. et al. Effects of local grain misorientation and β-Sn elastic anisotropy on whisker and hillock formation–CORRIGENDUM. Journal of Materials Research 28, 785 (2013). https://doi.org/10.1557/jmr.2013.15

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